Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | SM85 |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| Number of terminals | 100 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP100,.7X1.0 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 1024 |
| rom(word) | 24576 |
| ROM programmability | MROM |
| speed | 6 MHz |
| Maximum slew rate | 20 mA |
| surface mount | YES |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.635 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| SM8502(QFP) | SM8502(LQFP) | SM8503(LQFP) | SM8503(QFP) | SM8505(QFP) | SM8505(LQFP) | |
|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | SM85 | SM85 | SM85 | SM85 | SM85 | SM85 |
| JESD-30 code | R-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | S-PQFP-G100 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP | QFP | QFP | LQFP | LFQFP |
| Encapsulate equivalent code | QFP100,.7X1.0 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | QFP100,.7X1.0 | QFP100,.7X1.0 | QFP100,.63SQ,20 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH |
| power supply | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 1024 | 1024 | 1024 | 1024 | 2048 | 2048 |
| rom(word) | 24576 | 24576 | 32768 | 32768 | 49152 | 49152 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM |
| speed | 6 MHz | 6 MHz | 6 MHz | 6 MHz | 6 MHz | 6 MHz |
| Maximum slew rate | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| surface mount | YES | YES | YES | YES | YES | YES |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULLWING | GULLWING |
| Terminal pitch | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm | 0.65 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |