SP8741BDG datasheet, PDF - EEWORLD Datasheet

SP8741BDG: DescriptionPrescaler, 8741 Series, 1-Func, CDIP16, DG-16; Categorylogic logic; File Size1MB，5 Pages; ManufacturerZarlink Semiconductor (Microsemi); Websitehttp://www.zarlink.com/

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SP8741BDG Overview

Prescaler, 8741 Series, 1-Func, CDIP16, DG-16

Parameter Name	Attribute value
package instruction	DIP,
Reach Compliance Code	unknown
series	8741
JESD-30 code	R-GDIP-T16
JESD-609 code	e0
Logic integrated circuit type	PRESCALER
Number of data/clock inputs	1
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Output characteristics	EMITTER FOLLOWER
Output polarity	COMPLEMENTARY
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	6 ns
Certification status	Not Qualified
Maximum seat height	5.08 mm
surface mount	NO
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
minfmax	300 MHz
Base Number Matches	1

Obsolescence Notice

This product is obsolete.

This information is available for your

convenience only.

For more information on

Zarlink’s obsolete products and

replacement product lists, please visit

http://products.zarlink.com/obsolete_products/

	SP8741BDG	SP8740ADG	SP8740BDG
Description	Prescaler, 8741 Series, 1-Func, CDIP16, DG-16	Prescaler, 8740 Series, 1-Func, CDIP16, DG-16	Prescaler, 8740 Series, 1-Func, CDIP16, DG-16
package instruction	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown
series	8741	8740	8740
JESD-30 code	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16
JESD-609 code	e0	e0	e0
Logic integrated circuit type	PRESCALER	PRESCALER	PRESCALER
Number of data/clock inputs	1	1	1
Number of functions	1	1	1
Number of terminals	16	16	16
Maximum operating temperature	70 °C	125 °C	70 °C
Minimum operating temperature	-30 °C	-55 °C	-30 °C
Output characteristics	EMITTER FOLLOWER	EMITTER FOLLOWER	EMITTER FOLLOWER
Output polarity	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
propagation delay (tpd)	6 ns	6 ns	6 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm
surface mount	NO	NO	NO
Temperature level	OTHER	MILITARY	OTHER
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm
minfmax	300 MHz	300 MHz	300 MHz
Maker	-	Zarlink Semiconductor (Microsemi)	Zarlink Semiconductor (Microsemi)

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