Prescaler, 8740 Series, 1-Func, CDIP16, DG-16
| Parameter Name | Attribute value |
| Maker | Zarlink Semiconductor (Microsemi) |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| series | 8740 |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | PRESCALER |
| Number of data/clock inputs | 1 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | EMITTER FOLLOWER |
| Output polarity | COMPLEMENTARY |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| propagation delay (tpd) | 6 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| surface mount | NO |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| minfmax | 300 MHz |

| SP8740ADG | SP8741BDG | SP8740BDG | |
|---|---|---|---|
| Description | Prescaler, 8740 Series, 1-Func, CDIP16, DG-16 | Prescaler, 8741 Series, 1-Func, CDIP16, DG-16 | Prescaler, 8740 Series, 1-Func, CDIP16, DG-16 |
| package instruction | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown |
| series | 8740 | 8741 | 8740 |
| JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| Logic integrated circuit type | PRESCALER | PRESCALER | PRESCALER |
| Number of data/clock inputs | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -30 °C | -30 °C |
| Output characteristics | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER |
| Output polarity | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| propagation delay (tpd) | 6 ns | 6 ns | 6 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
| surface mount | NO | NO | NO |
| Temperature level | MILITARY | OTHER | OTHER |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 7.62 mm |
| minfmax | 300 MHz | 300 MHz | 300 MHz |
| Maker | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) |