In addition, this device has been tested and conforms to the same parametric specifications as previous versions of
the device.
For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales represen-
tative
318138-002
Revision 2.7
Revision History
Revision
Date
Aug 2002
Sep 2002
Revision
0.25
0.75
• Initial Release.
Description
• Changed package diagram to molded plastic BGA.
• Added DC/AC specifications.
• Corrected pinout information.
• Identified FIFO as 64 KB and verified ballout tables.
• Added 82547GI coverage.
• Signals CLKR_CAP and XTAL_CAP changed to RSVD_NC and NC, respectively.
• Added Architecture Overview chapter.
• Update signal names to match Design Guide and EEPROM Map and Program-
ming Application Note.
• Updated lead-free information.
• Added information about migrating from a 2-layer 0.36 mm wide-trace substrate
to a 2-layer 0.32 mm wide-trace substrate. Refer to the section on Package and
Pinout Information.
• Added statement that no changes to existing soldering processes are needed for
the 2-layer 0.32 mm wide-trace substrate change in the section describing “Pack-
age Information”.
• Added new maximum values for DC supply voltages on 1.2 V and 1.8 V pins. See
Table 2, Recommended Operating Conditions and Table 6, DC Characteristics.
• Corrected the FLSH_SO/LAN_DISABLE signal definition. If Flash functionality is
not used then an external pull-down resistor is required.
• Corrected the FLSH_SO/LAN_DISABLE signal definition. If Flash functionality is
not used then an external pull-up resistor is required.
• Removed note “b” from Table 2 and note “a” from Tables 3 and 4.
• Moved the note following Table 5 before Table 3.
• Replace Intel logo, updated the Product Features title page, and document order-
ing information.
• Updated Section 3.3. Removed the internal pullup device text from the FLASH
Serial Data Output / LAN Disable pin description.
Oct 2002
July 2003
Oct 2004
1.0
1.5
2.0
Nov 2004
2.1
Jan 2005
Apr 2005
June 2006
Aug 2006
Aug 2007
Dec 2007
2.2
2.3
2.4
2.5
2.6
2.7
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 82541 Family of Gigabit Ethernet Controllers may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-
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Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
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