|
TMS320DM6443ZWT |
TMS320DM6443AZWT |
TMS320DM6443BZWT |
| Description |
DaVinci Digital Media System-on-Chip 361-NFBGA |
DaVinci Digital Media System-on-Chip 361-NFBGA |
DaVinci Digital Media System-on-Chip 361-NFBGA |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
BGA |
| package instruction |
LFBGA, BGA361,19X19,32 |
BGA-361 |
BGA-316 |
| Contacts |
361 |
361 |
361 |
| Reach Compliance Code |
unknow |
compliant |
compliant |
| Factory Lead Time |
1 week |
6 weeks |
6 weeks |
| bit size |
32 |
32 |
32 |
| Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
| JESD-30 code |
S-PBGA-B361 |
S-PBGA-B361 |
S-PBGA-B361 |
| length |
16 mm |
16 mm |
16 mm |
| Humidity sensitivity level |
3 |
3 |
3 |
| Number of terminals |
361 |
361 |
316 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFBGA |
LFBGA |
LFBGA |
| Encapsulate equivalent code |
BGA361,19X19,32 |
BGA361,19X19,32 |
BGA361,19X19,32 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| power supply |
1.2,1.8,3.3 V |
1.2,1.8,3.3 V |
1.2,1.8/3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM (number of words) |
16384 |
16384 |
20480 |
| Maximum seat height |
1.4 mm |
1.4 mm |
1.4 mm |
| Maximum supply voltage |
1.26 V |
1.26 V |
1.26 V |
| Minimum supply voltage |
1.14 V |
1.14 V |
1.14 V |
| Nominal supply voltage |
1.2 V |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
OTHER |
OTHER |
OTHER |
| Terminal form |
BALL |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
16 mm |
16 mm |
16 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
| Other features |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
- |
| Is it lead-free? |
- |
Lead free |
Lead free |
| ECCN code |
- |
3A991.A.2 |
3A991.A.2 |
| Bus compatibility |
- |
ETHERNET; I2C; SPI; UART; USB |
ETHERNET; I2C; SPI; UART; USB |
| External data bus width |
- |
48 |
48 |
| JESD-609 code |
- |
e1 |
e1 |
| Terminal surface |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Base Number Matches |
- |
1 |
1 |