CAT22C12P-30 datasheet, PDF - EEWORLD Datasheet

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CAT22C12P-30: DescriptionNon-Volatile SRAM, 256X4, 300ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18; Categorystorage storage; File Size258KB，8 Pages; ManufacturerCatalyst; Websitehttp://www.catalyst-semiconductor.com/

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CAT22C12P-30 Overview

Non-Volatile SRAM, 256X4, 300ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18

CAT22C12P-30 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	300 ns
Other features	10 YEARS DATA RETENTION
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
length	21.971 mm
memory density	1024 bit
Memory IC Type	NON-VOLATILE SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	18
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X4
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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CAT22C12P-30 Related Products

	CAT22C12P-30	CAT22C12P-20	CAT22C12PI-30	CAT22C12PI-20
Description	Non-Volatile SRAM, 256X4, 300ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18	Non-Volatile SRAM, 256X4, 200ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18	Non-Volatile SRAM, 256X4, 300ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18	Non-Volatile SRAM, 256X4, 200ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3
Contacts	18	18	18	18
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	300 ns	200 ns	300 ns	200 ns
Other features	10 YEARS DATA RETENTION	10 YEARS DATA RETENTION	10 YEARS DATA RETENTION	10 YEARS DATA RETENTION
JESD-30 code	R-PDIP-T18	R-PDIP-T18	R-PDIP-T18	R-PDIP-T18
JESD-609 code	e0	e0	e0	e0
length	21.971 mm	21.971 mm	21.971 mm	21.971 mm
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	4	4	4	4
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	18	18	18	18
word count	256 words	256 words	256 words	256 words
character code	256	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C
organize	256X4	256X4	256X4	256X4
Exportable	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.57 mm	4.57 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	-

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