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89HPES24T6G2ZCALG8

Description
FCBGA-324, Reel
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,55 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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89HPES24T6G2ZCALG8 Overview

FCBGA-324, Reel

89HPES24T6G2ZCALG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeFCBGA
package instructionBGA, BGA324,18X18,40
Contacts324
Manufacturer packaging codeALG324
Reach Compliance Codecompliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI; SMBUS
maximum clock frequency100 MHz
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
24-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES24T6G2
Data Sheet
The 89HPES24T6G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T6G2 is a 24-lane, 6-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and up to five
downstream ports and supports switching between downstream ports.
Device Overview
Features
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to six switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
6-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 54
April 30, 2013
DSC 6930

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Description FCBGA-324, Reel FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to incompatible incompatible
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA
Contacts 324 324 324 324 324
Manufacturer packaging code ALG324 ALG324 ALG324 AL324 AL324
Reach Compliance Code compliant compliant compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e1 e1 e1 e0 e0
Humidity sensitivity level 4 4 4 4 4
Number of terminals 324 324 324 324 324
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 225 225
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1
package instruction BGA, BGA324,18X18,40 FCBGA-324 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 - FCBGA-324
Bus compatibility PCI; SMBUS PCI; SMBUS PCI - PCI; SMBUS
maximum clock frequency 100 MHz 100 MHz 125 MHz - 100 MHz
length 19 mm 19 mm 19 mm - 19 mm
Maximum seat height 3.42 mm 3.42 mm 3.42 mm - 3.42 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V - 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V - 0.9 V
Nominal supply voltage 1 V 1 V 1 V - 1 V
width 19 mm 19 mm 19 mm - 19 mm
Maker - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) -
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