MPC5567MVZ132R datasheet, PDF - EEWORLD Datasheet

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MPC5567MVZ132R: DescriptionIC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，66 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MPC5567MVZ132R Overview

IC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC

MPC5567MVZ132R Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	BGA, BGA324,22X22,40
Contacts	324
Reach Compliance Code	compliant
bit size	32
JESD-30 code	S-PBGA-B324
JESD-609 code	e3
Humidity sensitivity level	1
Number of terminals	324
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA324,22X22,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	1.5,3.3,5 V
Certification status	Not Qualified
RAM (bytes)	81920
rom(word)	2097152
ROM programmability	FLASH
speed	132 MHz
Maximum slew rate	600 mA
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	MATTE TIN
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: MPC5567

Rev. 1.0, 11/2007

MPC5567

Microcontroller Data Sheet

by: Microcontroller Division

This document provides electrical specifications, pin

assignments, and package diagrams for the MPC5567

microcontroller device. For functional characteristics,

refer to the

MPC5567 Microcontroller Reference

Manual.

Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.2 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 5

3.3 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.4 EMI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.5 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9

3.6 VRC and POR Electrical Specifications . . . . . . . . . 9

3.7 Power-Up/Down Sequencing . . . . . . . . . . . . . . . . 10

3.8 DC Electrical Specifications. . . . . . . . . . . . . . . . . . 12

3.9 Oscillator and FMPLL Electrical Characteristics . . 20

3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22

3.11 H7Fa Flash Memory Electrical Characteristics . . . 23

3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.14 Fast Ethernet Controller Specifications . . . . . . . . . 46

Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1 MPC5567 324 PBGA Pinout . . . . . . . . . . . . . . . . .

4.2 MPC5567 416 PBGA Pinout . . . . . . . . . . . . . . . . .

4.3 MPC5567 324-Pin Package Dimensions . . . . . . .

4.4 MPC5567 416-Pin Package Dimensions . . . . . . .

Overview

The MPC5567 microcontroller (MCU) is a member of

the MPC5500 family of microcontrollers built on the

Power Architecture™ embedded technology. This

family of parts has many new features coupled with high

performance CMOS technology to provide substantial

reduction of cost per feature and significant performance

improvement over the MPC500 family.

The host processor core of this device complies with the

Power Architecture embedded category that is 100%

user-mode compatible (including floating point library)

with the original Power PC™ user instruction set

architecture (UISA). The embedded architecture

enhancements improve the performance in embedded

applications. The core also has additional instructions,

including digital signal processing (DSP) instructions,

beyond the original Power PC instruction set.

Revision History for the MPC5567 Data Sheet . . . . . . 58

5.1 Information Changed Between Revisions

0.0 and 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Overview

The MPC5500 family of parts contains many new features coupled with high performance CMOS

technology to provide significant performance improvement over the MPC565.

The host processor core of the MPC5567 also includes an instruction set enhancement allowing variable

length encoding (VLE). This allows optional encoding of mixed 16- and 32-bit instructions. With this

enhancement, it is possible to significantly reduce the code size footprint.

The MPC5567 has two levels of memory hierarchy. The fastest accesses are to the 8-kilobytes (KB)

unified cache. The next level in the hierarchy contains the 80-KB on-chip internal SRAM and 2-megabytes

(MB) internal flash memory. The internal SRAM and flash memory hold instructions and data. The

external bus interface is designed to support most of the standard memories used with the MPC5xx family.

The complex input/output timer functions of the MPC5567 are performed by an enhanced time processor

unit (eTPU) engine. The eTPU engine controls 32 hardware channels. The eTPU has been enhanced over

the TPU by providing 24-bit timers, double-action hardware channels, variable number of parameters per

channel, angle clock hardware, and additional control and arithmetic instructions. The eTPU is

programmed using a high-level programming language.

The less complex timer functions of the MPC5567 are performed by the enhanced modular input/output

system (eMIOS). The eMIOS’ 24 hardware channels are capable of single-action, double-action,

pulse-width modulation (PWM), and modulus-counter operations. Motor control capabilities include

edge-aligned and center-aligned PWM.

Off-chip communication is performed by a suite of serial protocols including controller area networks

(FlexCANs), enhanced deserial/serial peripheral interfaces (DSPIs), and enhanced serial communications

interfaces (eSCIs). The DSPIs support pin reduction through hardware serialization and deserialization of

timer channels and general-purpose input/output (GPIOs) signals.

The MCU has an on-chip 40-channel enhanced queued dual analog-to-digital converter (eQADC).

The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration

and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset

control are also determined by the SIU. The internal multiplexer submodule (SIU_DISR) provides

multiplexing of eQADC trigger sources, daisy chaining the DSPIs, and external interrupt signal

multiplexing.

The Fast Ethernet (FEC) module is a RISC-based controller that supports both 10 and 100 Mbps

Ethernet/IEEE® 802.3 networks and is compatible with three different standard MAC (media access

controller) PHY (physical) interfaces to connect to an external Ethernet bus. The FEC supports the 10 or

100 Mbps MII (media independent interface), and the 10 Mbps-only with a seven-wire interface, which

uses a subset of the MII signals. The upper 16-bits of the 32-bit external bus interface (EBI) are used to

connect to an external Ethernet device. The FEC contains built-in transmit and receive message FIFOs and

DMA support.

The FlexRay controller provides functional node networking, with static and dynamic host access, to

develop highly dependable automotive control systems that require the full implementation of the Flexray

protocol, as published in

FlexRay Protocol Specification 2.0.

The FlexRay module uses fault-tolerant,

time-triggered events and clock synchronization mechanisms to maintain the global time of the functional

nodes. Bus guardian operations are available for each channel in a multi- or redundant-channel

configuration.

MPC5567 Microcontroller Data Sheet, Rev. 1.0

Freescale Semiconductor

MPC5567MVZ132R Related Products

	MPC5567MVZ132R	MPC5567MVZ112R	MPC5567MVR112R	MPC5567MZP112R	MPC5567MZP132R	MPC5567MZP80R	MPC5567MZQ112R	MPC5567MZQ132R	MPC5567MZQ80R
Description	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,324PIN,PLASTIC
Is it lead-free?	Lead free	Lead free	Lead free	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA324,22X22,40	BGA, BGA324,22X22,40	BGA, BGA416,26X26,40	BGA, BGA416,26X26,40	BGA, BGA416,26X26,40	BGA, BGA416,26X26,40	BGA, BGA324,22X22,40	BGA, BGA324,22X22,40	BGA, BGA324,22X22,40
Contacts	324	324	416	416	416	416	324	324	324
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
bit size	32	32	32	32	32	32	32	32	32
JESD-30 code	S-PBGA-B324	S-PBGA-B324	S-PBGA-B416	S-PBGA-B416	S-PBGA-B416	S-PBGA-B416	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324
Humidity sensitivity level	1	1	1	1	1	1	1	1	1
Number of terminals	324	324	416	416	416	416	324	324	324
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA324,22X22,40	BGA324,22X22,40	BGA416,26X26,40	BGA416,26X26,40	BGA416,26X26,40	BGA416,26X26,40	BGA324,22X22,40	BGA324,22X22,40	BGA324,22X22,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	225	225
power supply	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V	1.5,3.3,5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	81920	81920	81920	81920	81920	81920	81920	81920	81920
rom(word)	2097152	2097152	2097152	2097152	2097152	2097152	2097152	2097152	2097152
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	132 MHz	112 MHz	112 MHz	112 MHz	132 MHz	80 MHz	112 MHz	132 MHz	80 MHz
Maximum slew rate	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA	600 mA
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Maker	-	-	NXP	NXP	NXP	NXP	NXP	NXP	NXP

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