EEWORLDEEWORLDEEWORLD

Part Number

Search

BAT54C/T4

Description
0.2A, 30V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size297KB,11 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

BAT54C/T4 Overview

0.2A, 30V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3

BAT54C/T4 Parametric

Parameter NameAttribute value
Parts packaging codeSOT-23
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1 V
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
Maximum non-repetitive peak forward current0.6 A
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current0.2 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum power dissipation0.23 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage30 V
Maximum reverse current2 µA
Maximum reverse recovery time0.005 µs
surface mountYES
technologySCHOTTKY
Terminal formGULL WING
Terminal locationDUAL
Base Number Matches1
SO
T2
3
BAT54 series
Schottky barrier diodes
Rev. 5 — 5 October 2012
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diodes with an integrated guard ring for stress protection,
encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic
package.
1.2 Features and benefits
Low forward voltage
Low capacitance
AEC-Q101 qualified
1.3 Applications
Ultra high-speed switching
Line termination
Voltage clamping
Reverse polarity protection
1.4 Quick reference data
Table 1.
Quick reference data
T
amb
= 25
C unless otherwise specified.
Symbol
Per diode
V
R
V
F
I
R
[1]
Parameter
reverse voltage
forward voltage
reverse current
Conditions
Min
-
Typ
-
-
-
Max
30
800
2
Unit
V
mV
A
I
F
= 100 mA
V
R
= 25 V
[1]
[1]
-
-
Pulse test: t
p
300
s;  
0.02.
2. Pinning information
Table 2.
Pin
BAT54
1
2
3
anode
not connected
cathode
1
2
3
1
3
2
n.c.
006aaa436
Pinning
Description
Simplified outline
Graphic symbol

BAT54C/T4 Related Products

BAT54C/T4 BAT54S/T4 BAT54A/T3 BAT54S/T3 BAT54C/T3 BAT54/T3 BAT54/T4 BAT54-T
Description 0.2A, 30V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 85V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 30V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 85V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 30V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 30V, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 30V, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 0.2A, 30V, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3
Parts packaging code SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23
package instruction R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
Contacts 3 3 3 3 3 3 3 3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Configuration COMMON CATHODE, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON CATHODE, 2 ELEMENTS SINGLE SINGLE SINGLE
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Diode type RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE
Maximum forward voltage (VF) 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
JEDEC-95 code TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB
JESD-30 code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
Maximum non-repetitive peak forward current 0.6 A 0.6 A 0.6 A 0.6 A 0.6 A 0.6 A 0.6 A 0.6 A
Number of components 2 2 2 2 2 1 1 1
Number of terminals 3 3 3 3 3 3 3 3
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 125 °C 150 °C
Maximum output current 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A 0.2 A
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Maximum power dissipation 0.23 W 0.23 W 0.23 W 0.23 W 0.23 W 0.23 W 0.23 W 0.23 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 30 V 85 V 30 V 85 V 30 V 30 V 30 V 30 V
Maximum reverse current 2 µA 2 µA 2 µA 2 µA 2 µA 2 µA 2 µA 2 µA
Maximum reverse recovery time 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs 0.005 µs
surface mount YES YES YES YES YES YES YES YES
technology SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY SCHOTTKY
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C - -55 °C
Maker - NXP NXP NXP NXP NXP NXP NXP
Is it lead-free? - - Lead free Lead free Lead free Lead free - Lead free
Is it Rohs certified? - - conform to conform to conform to conform to - conform to
JESD-609 code - - e3 e3 e3 e3 - e3
Peak Reflow Temperature (Celsius) - - 260 260 260 260 - 260
Terminal surface - - TIN Tin (Sn) Tin (Sn) Tin (Sn) - TIN
Maximum time at peak reflow temperature - - 40 40 40 40 - 40
How to burn the program in FLASH and run it in RAM using CCS6 and TMS320F28335
I am a beginner in DSP. In order to save the program to the chip, I followed the method on the Internet, deleted 28335_RAM_lnk.cmd, and then added F28335.cmd file. However, only some programs were suc...
CQUT DSP and ARM Processors
How to display bmp images in ADS?
I'm new to this area of study. Does anyone know how to write a program to display a bmp image on an LCD? Has anyone written one before?...
hsygzdc Embedded System
Where can I download the STLink driver?
Where can I download the ST Link driver?...
pka1987 stm32/stm8
[Tool Tutorial] CH340 USB to Serial Chip Driver Installation Instructions
CH340 USB to Serial Chip Driver Installation InstructionsCurrently, many development boards use CH340 as a USB to serial port solution. The Xinluheng FPGA development board also provides a USB to seri...
小梅哥 FPGA/CPLD
Changsha City recruits an assistant engineer in electronics
Changsha is looking for an assistant engineer. Requirements: Proficient in using PCB board making software such as PORTEL, familiar with the MCU 51 AVR series. Familiar with C language. Strong hands-o...
dengqiang Embedded System
[Posted] 600 yuan for 99 new STK500
Product Introduction:AVR AT STK500 programmer/entry-level learning development board is an AVR serial programmer developed by ATMEL. STK500 supports HVSP/HVPP/ISP (serial high voltage programming, par...
wanghongyang Buy&Sell

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1623  2155  1144  2502  767  33  44  24  51  16 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号