RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR

| M54HC109_04 | M54HC109 | M54HC109K | M54HC109D | M54HC109D1 | M54HC109K1 | |
|---|---|---|---|---|---|---|
| Description | RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR | RAD-HARD DUAL J-K FLIP FLOP WITH PRESET AND CLEAR |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible |
| Maker | - | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | - | - | DFP | DIP | DIP | DFP |
| package instruction | - | - | DFP, FL16,.3 | CERAMIC, DIP-16 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Contacts | - | - | 16 | 16 | 16 | 16 |
| Reach Compliance Code | - | - | _compli | _compli | _compli | _compli |
| series | - | - | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | - | - | R-CDFP-F16 | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 |
| JESD-609 code | - | - | e0 | e0 | e0 | e0 |
| length | - | - | 9.94 mm | 20.32 mm | 20.32 mm | 9.94 mm |
| Load capacitance (CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | - | - | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP |
| Maximum Frequency@Nom-Su | - | - | 21000000 Hz | 21000000 Hz | 21000000 Hz | 21000000 Hz |
| MaximumI(ol) | - | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| Number of digits | - | - | 2 | 2 | 2 | 2 |
| Number of functions | - | - | 2 | 2 | 2 | 2 |
| Number of terminals | - | - | 16 | 16 | 16 | 16 |
| Maximum operating temperature | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| Output polarity | - | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| Package body material | - | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | - | - | DFP | DIP | DIP | DFP |
| Encapsulate equivalent code | - | - | FL16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| Peak Reflow Temperature (Celsius) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | - | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | - | - | 45 ns | 45 ns | 45 ns | 45 ns |
| propagation delay (tpd) | - | - | 225 ns | 225 ns | 225 ns | 225 ns |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 2.38 mm | 3.83 mm | 3.83 mm | 2.38 mm |
| Maximum supply voltage (Vsup) | - | - | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | - | - | 2 V | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| surface mount | - | - | YES | NO | NO | YES |
| technology | - | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | - | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | - | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | - | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | - | - | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| total dose | - | - | 50k Rad(Si) V | 50k Rad(Si) V | 50k Rad(Si) V | 50k Rad(Si) V |
| Trigger type | - | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| width | - | - | 6.91 mm | 7.62 mm | 7.62 mm | 6.91 mm |
| minfmax | - | - | 25 MHz | 25 MHz | 25 MHz | 25 MHz |