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AM29LV640M102WHF

Description
Flash, 4MX16, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63
Categorystorage    storage   
File Size97KB,7 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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AM29LV640M102WHF Overview

Flash, 4MX16, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63

AM29LV640M102WHF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeBGA
package instruction11 X 12 MM, 0.80 MM PITCH, FBGA-63
Contacts63
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time100 ns
JESD-30 codeR-PBGA-B63
JESD-609 codee1
length12 mm
memory density67108864 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals63
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
typeNOR TYPE
width11 mm
Base Number Matches1
ADVANCE INFORMATION
Am29LV640M
64 Megabit (4 M x 16-Bit) MirrorBit™ 3.0 Volt-only
Uniform Sector Flash Memory with VersatileI/O™ Control
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
s
Single power supply operation
— 2.7–3.6 V for read, erase, and program operations
s
VersatileI/O™ control
— Device generates data output voltages and tolerates
data input voltages as determined by the voltage on
the V
IO
pin; operates from 1.65 to 3.6 V
s
Manufactured on 0.23 µm MirrorBit process
technology
s
SecSi™ (Secured Silicon) Sector region
— 128-word sector for permanent, secure identification
through an 8-word random Electronic Serial Number,
accessible through a command sequence
— May be programmed and locked at the factory or by
the customer
s
Flexible sector architecture
— One hundred twenty-eight 32 Kword sectors
s
Compatibility with JEDEC standards
— Provides pinout and software compatibility for
single-power supply flash, and superior inadvertent
write protection
s
Minimum 100,000 erase cycle guarantee per sector
s
20-year data retention at 125°C
PERFORMANCE CHARACTERISTICS
s
High performance
— 90 ns access time
— 25 ns page read times
— 1 s typical sector erase time
— 5.9 µs typical write buffer word programming time:
16-word write buffer reduces overall programming
time for multiple-word updates
— 4-word page read buffer
— 16-word write buffer
s
Low power consumption (typical values at 3.0 V, 5
MHz)
— 30 mA typical active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
s
Package options
— 63-ball FBGA
SOFTWARE & HARDWARE FEATURES
s
Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
s
Hardware features
— Sector Group Protection: hardware-level method of
preventing write operations within a sector group
— Temporary Sector Unprotect: V
ID
-level method of
changing code in locked sectors
— ACC (high voltage) input accelerates programming
time for higher throughput during system production
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) indicates program or
erase cycle completion
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
25301
Rev:
A
Amendment/0
Issue Date:
August 3, 2001
Refer to AMD’s Website (www.amd.com) for the latest information.

AM29LV640M102WHF Related Products

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Description Flash, 4MX16, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 Flash, 4MX16, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 Flash, 4MX16, 90ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 Flash, 4MX16, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 Flash, 4MX16, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 Flash, 4MX16, 90ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63
Is it Rohs certified? conform to conform to incompatible incompatible incompatible conform to
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction 11 X 12 MM, 0.80 MM PITCH, FBGA-63 11 X 12 MM, 0.80 MM PITCH, FBGA-63 11 X 12 MM, 0.80 MM PITCH, FBGA-63 11 X 12 MM, 0.80 MM PITCH, FBGA-63 11 X 12 MM, 0.80 MM PITCH, FBGA-63 11 X 12 MM, 0.80 MM PITCH, FBGA-63
Contacts 63 63 63 63 63 63
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 100 ns 100 ns 90 ns 100 ns 100 ns 90 ns
JESD-30 code R-PBGA-B63 R-PBGA-B63 R-PBGA-B63 R-PBGA-B63 R-PBGA-B63 R-PBGA-B63
JESD-609 code e1 e1 e0 e0 e0 e1
length 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 63 63 63 63 63 63
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 240 240 240 260
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN LEAD TIN LEAD TIN SILVER COPPER
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40 30 30 30 40
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 11 mm 11 mm 11 mm 11 mm 11 mm 11 mm
Base Number Matches 1 1 1 1 - -
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