MMC2080VF001 datasheet, PDF - EEWORLD Datasheet

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MMC2080VF001: DescriptionIC,MICROCONTROLLER,32-BIT,CMOS,BGA,144PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，34 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MMC2080VF001 Overview

IC,MICROCONTROLLER,32-BIT,CMOS,BGA,144PIN,PLASTIC

MMC2080VF001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	FBGA, BGA144,13X13,32
Reach Compliance Code	unknown
bit size	32
JESD-30 code	S-PBGA-B144
JESD-609 code	e0
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA144,13X13,32
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	3 V
Certification status	Not Qualified
RAM (bytes)	6144
rom(word)	24576
ROM programmability	MROM
speed	10 MHz
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Base Number Matches	1

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Freescale Semiconductor, Inc.

MMC2080/2075/D

Rev. 0, 10/1999

Semiconductor Products Sector

MMC2080/2075

Freescale Semiconductor, Inc...

Advance Information

MMC2080/2075 Integrated Processor with

Roaming FLEX™ Decoder

Part 1 Introduction

The MMC2080/2075 is designed to provide the messaging and paging marketplace with a powerful and

flexible solution to carry communications design into the next millennium. The MMC2080 integrates two

of Motorola’s most successful product families, M•CORE™ and the Roaming FLEX™ alphanumeric

decoders, a combination that will set a new standard in the communications industry. Except for the FLEX

decoder, the MMC2075 offers all features of the MMC2080.

Both the The MMC2080/2075 are members of the low-power, high-performance M•CORE family of 32-bit

microcontroller units (MCUs). The M•CORE is a streamlined execution engine that provides many of the

performance enhancements found in mainstream reduced instruction set computers (RISCs). Combining

performance, speed, and cost efficiency in a compact, low-power design, the M•CORE microRISC

architecture is a natural solution for applications where battery life and systems cost are critical design goals.

Given that a total system’s components and processor core determine its power consumption, the instruction

set architecture (ISA) for the M•CORE is designed to optimize the trade-off between performance and total

power consumption. The result is system-wide reduction of total energy consumption with maintenance of

acceptable performance levels. Memory power consumption (both on-chip and external) is a major factor in

system energy consumption. By adopting 16-bit instruction encoding, and thus significantly decreasing the

memory bandwidth needed for a high rate of instruction execution, the MMC2080/2075 minimizes the

overhead of memory system energy consumption.

The MMC2080/2075 also reduces power consumption by coupling a fully static design with dynamic power

management and low-voltage operation. Versatile power management is achieved through automatic power

downs of any internal functional blocks not needed on a clock-by-clock basis. Power conservation modes

are also provided for absolute power conservation.

A table of contents for this document appears on the following page. Figure 1 on page 3 and Figure 2 on

page 4 provide simplified block diagrams of the MMC2080/2075.

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

Part 1

1.1

1.2

1.3

1.4

1.5

1.6

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Conventions and Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Integrated Roaming FLEX Protocol and the MMC2080 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Target Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Part 2 Signal and Connection Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1

MMC2080/2075 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.2

Tables of Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Part 3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.1

General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.2

Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Part 4

4.1

4.2

4.3

Pin-out and Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

BGA Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

PGA Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Ordering Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Freescale Semiconductor, Inc...

Part 5 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

5.1

Heat Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

5.2

Electrical Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

MMC2080/2075 Technical Data

For More Information On This Product,

Preliminary

Go to: www.freescale.com

MMC2080VF001 Related Products

	MMC2080VF001	MMC2075VF001
Description	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,144PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CMOS,BGA,144PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible
package instruction	FBGA, BGA144,13X13,32	FBGA, BGA144,13X13,32
Reach Compliance Code	unknown	unknown
bit size	32	32
JESD-30 code	S-PBGA-B144	S-PBGA-B144
JESD-609 code	e0	e0
Number of terminals	144	144
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA
Encapsulate equivalent code	BGA144,13X13,32	BGA144,13X13,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	3 V	3 V
Certification status	Not Qualified	Not Qualified
RAM (bytes)	6144	6144
rom(word)	24576	24576
ROM programmability	MROM	MROM
speed	10 MHz	10 MHz
Nominal supply voltage	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Base Number Matches	1	1

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