Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

| HN58X2504I | HN58X2502FPIE | HN58X2502I | HN58X2504FPIE | HN58X2504TIE | HN58X2502TIE | |
|---|---|---|---|---|---|---|
| Description | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory |
| Parts packaging code | - | SOIC | - | SOIC | SOIC | SOIC |
| package instruction | - | 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 | - | 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 | 4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8 | 4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8 |
| Contacts | - | 8 | - | 8 | 8 | 8 |
| Reach Compliance Code | - | compliant | - | compli | compli | compli |
| ECCN code | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | - | 3 MHz | - | 3 MHz | 3 MHz | 3 MHz |
| JESD-30 code | - | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| length | - | 4.89 mm | - | 4.89 mm | 4.4 mm | 4.4 mm |
| memory density | - | 2048 bit | - | 4096 bi | 4096 bi | 2048 bi |
| Memory IC Type | - | EEPROM | - | EEPROM | EEPROM | EEPROM |
| memory width | - | 8 | - | 8 | 8 | 8 |
| Number of functions | - | 1 | - | 1 | 1 | 1 |
| Number of terminals | - | 8 | - | 8 | 8 | 8 |
| word count | - | 256 words | - | 512 words | 512 words | 256 words |
| character code | - | 256 | - | 512 | 512 | 256 |
| Operating mode | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| organize | - | 256X8 | - | 512X8 | 512X8 | 256X8 |
| Package body material | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | SOP | - | SOP | TSSOP | TSSOP |
| Package shape | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | - | SERIAL | - | SERIAL | SERIAL | SERIAL |
| Certification status | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 1.73 mm | - | 1.73 mm | 1.1 mm | 1.1 mm |
| Serial bus type | - | SPI | - | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| Nominal supply voltage (Vsup) | - | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V |
| surface mount | - | YES | - | YES | YES | YES |
| technology | - | CMOS | - | CMOS | CMOS | CMOS |
| Temperature level | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | - | GULL WING | - | GULL WING | GULL WING | GULL WING |
| Terminal pitch | - | 1.27 mm | - | 1.27 mm | 0.65 mm | 0.65 mm |
| Terminal location | - | DUAL | - | DUAL | DUAL | DUAL |
| width | - | 3.9 mm | - | 3.9 mm | 3 mm | 3 mm |
| Maximum write cycle time (tWC) | - | 8 ms | - | 8 ms | 8 ms | 8 ms |