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HN58X2504TIE

Description
Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Categorystorage    storage   
File Size168KB,22 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HN58X2504TIE Overview

Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

HN58X2504TIE Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instruction4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)3 MHz
JESD-30 codeR-PDSO-G8
length4.4 mm
memory density4096 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Certification statusNot Qualified
Maximum seat height1.1 mm
Serial bus typeSPI
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width3 mm
Maximum write cycle time (tWC)8 ms
HN58X2502I
HN58X2504I
Serial Peripheral Interface
2k EEPROM (256-word
×
8-bit)
4k EEPROM (512-word
×
8-bit)
Electrically Erasable and Programmable Read Only Memory
REJ03C0061-0200
Rev.2.00
Jul.05.2005
Description
HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and
Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing
advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 16-byte
page programming function to make it’s write operation faster.
Note: Renesas Technology’s serial EEPROM are authorized for using consumer applications such as cellular phones,
camcorders, audio equipments. Therefore, please contact Renesas Technology’s sales office before using
industrial applications such as automotive systems, embedded controllers, and meters.
Features
Single supply: 1.8 V to 5.5 V
Serial Peripheral Interface compatible (SPI bus)
SPI mode 0 (0,0), 3 (1,1)
Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)
Power dissipation:
Standby: 3
µA
(max)
Active (Read): 2 mA (max)
Active (Write): 2.5 mA (max)
Automatic page write: 16-byte/page
Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)
Endurance: 10
6
Erase/Write Cycles
Data retention: 10 Years
Small size packages: SOP-8pin, TSSOP-8pin
Shipping tape and reel
TSSOP-8pin: 3,000 IC/reel
SOP-8pin
: 2,500 IC/reel
Temperature range:
−40
to
+85 °C
Lead free product.
Rev.2.00, Jul.05.2005, page 1 of 20

HN58X2504TIE Related Products

HN58X2504TIE HN58X2502FPIE HN58X2502I HN58X2504I HN58X2504FPIE HN58X2502TIE
Description Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Parts packaging code SOIC SOIC - - SOIC SOIC
package instruction 4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 - - 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8
Contacts 8 8 - - 8 8
Reach Compliance Code compli compliant - - compli compli
ECCN code EAR99 EAR99 - - EAR99 EAR99
Maximum clock frequency (fCLK) 3 MHz 3 MHz - - 3 MHz 3 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 - - R-PDSO-G8 R-PDSO-G8
length 4.4 mm 4.89 mm - - 4.89 mm 4.4 mm
memory density 4096 bi 2048 bit - - 4096 bi 2048 bi
Memory IC Type EEPROM EEPROM - - EEPROM EEPROM
memory width 8 8 - - 8 8
Number of functions 1 1 - - 1 1
Number of terminals 8 8 - - 8 8
word count 512 words 256 words - - 512 words 256 words
character code 512 256 - - 512 256
Operating mode SYNCHRONOUS SYNCHRONOUS - - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C - - 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - - -40 °C -40 °C
organize 512X8 256X8 - - 512X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP - - SOP TSSOP
Package shape RECTANGULAR RECTANGULAR - - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE - - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL - - SERIAL SERIAL
Certification status Not Qualified Not Qualified - - Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.73 mm - - 1.73 mm 1.1 mm
Serial bus type SPI SPI - - SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V - - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V - - 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V - - 2.5 V 2.5 V
surface mount YES YES - - YES YES
technology CMOS CMOS - - CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL - - INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING - - GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm - - 1.27 mm 0.65 mm
Terminal location DUAL DUAL - - DUAL DUAL
width 3 mm 3.9 mm - - 3.9 mm 3 mm
Maximum write cycle time (tWC) 8 ms 8 ms - - 8 ms 8 ms
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