HN58X2516FPIAG datasheet, PDF - EEWORLD Datasheet

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HN58X2516FPIAG: DescriptionSerial Peripheral Interface Electrically Erasable and Programmable Read Only Memory; Categorystorage storage; File Size240KB，22 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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HN58X2516FPIAG Overview

Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

HN58X2516FPIAG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP, SOP8,.25
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Maximum clock frequency (fCLK)	5 MHz
Data retention time - minimum	10
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
length	4.89 mm
memory density	16384 bi
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	1.73 mm
Serial bus type	SPI
Maximum standby current	0.000003 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.9 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE

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HN58X2508IAG Series

HN58X2516IAG Series

Serial Peripheral Interface

8k EEPROM (1024-word

8-bit)

16k EEPROM (2048-word

8-bit)

Electrically Erasable and Programmable Read Only Memory

REJ03C0299-0100

Rev.1.00

Nov.08.2006

Description

HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and

Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing

advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 32-byte

page programming function to make it’s write operation faster.

Features

•

Single supply: 1.8 V to 5.5 V

•

Serial Peripheral Interface compatible (SPI bus)



SPI mode 0 (0,0), 3 (1,1)

•

Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)

•

Power dissipation:



Standby: 3

µA

(max)



Active (Read): 2.5 mA (max)



Active (Write): 3.0 mA (max)

•

Automatic page write: 32-byte/page

•

Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)

•

Endurance: 10

Erase/Write Cycles

•

Data retention: 10 Years

•

Small size packages: SOP-8pin, TSSOP-8pin

•

Shipping tape and reel



TSSOP-8pin: 3,000 IC/reel



SOP-8pin:

2,500 IC/reel

•

Temperature range:

−40

+85 °C

•

Lead free product.

Rev.1.00, Nov.08.2006, page 1 of 20

HN58X2516FPIAG Related Products

	HN58X2516FPIAG	HN58X2508IAG	HN58X2508FPIAG	HN58X2516IAG	HN58X2516TIAG	HN58X2508TIAG
Description	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Is it lead-free?	Lead free	-	Lead free	-	Lead free	Lead free
Is it Rohs certified?	conform to	-	conform to	-	conform to	conform to
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	SOIC	-	SOIC	-	SOIC	SOIC
package instruction	SOP, SOP8,.25	-	SOP, SOP8,.25	-	TSSOP, TSSOP8,.25	TSSOP, TSSOP8,.25
Contacts	8	-	8	-	8	8
Reach Compliance Code	compli	-	compli	-	compli	compli
ECCN code	EAR99	-	EAR99	-	EAR99	EAR99
Maximum clock frequency (fCLK)	5 MHz	-	5 MHz	-	5 MHz	5 MHz
Data retention time - minimum	10	-	10	-	10	10
Durability	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	-	R-PDSO-G8	-	R-PDSO-G8	R-PDSO-G8
length	4.89 mm	-	4.89 mm	-	4.4 mm	4.4 mm
memory density	16384 bi	-	8192 bi	-	16384 bi	8192 bi
Memory IC Type	EEPROM	-	EEPROM	-	EEPROM	EEPROM
memory width	8	-	8	-	8	8
Number of functions	1	-	1	-	1	1
Number of terminals	8	-	8	-	8	8
word count	2048 words	-	1024 words	-	2048 words	1024 words
character code	2000	-	1000	-	2000	1000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-40 °C	-40 °C
organize	2KX8	-	1KX8	-	2KX8	1KX8
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	SOP	-	TSSOP	TSSOP
Encapsulate equivalent code	SOP8,.25	-	SOP8,.25	-	TSSOP8,.25	TSSOP8,.25
Package shape	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	-	SERIAL	-	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	260	-	260	260
power supply	2/5 V	-	2/5 V	-	2/5 V	2/5 V
Certification status	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.73 mm	-	1.73 mm	-	1.1 mm	1.1 mm
Serial bus type	SPI	-	SPI	-	SPI	SPI
Maximum standby current	0.000003 A	-	0.000003 A	-	0.000003 A	0.000003 A
Maximum slew rate	0.003 mA	-	0.003 mA	-	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	-	1.8 V	-	1.8 V	1.8 V
surface mount	YES	-	YES	-	YES	YES
technology	CMOS	-	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	-	GULL WING	-	GULL WING	GULL WING
Terminal pitch	1.27 mm	-	1.27 mm	-	0.65 mm	0.65 mm
Terminal location	DUAL	-	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	3.9 mm	-	3.9 mm	-	3 mm	3 mm
Maximum write cycle time (tWC)	5 ms	-	5 ms	-	5 ms	5 ms
write protect	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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