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SUM35FSMSTX

Description
Rectifier Diode, 1 Element, 0.5A, Silicon, HERMETIC SEALED PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size76KB,2 Pages
ManufacturerSSDI
Websitehttp://www.ssdi-power.com/
Download Datasheet Parametric View All

SUM35FSMSTX Overview

Rectifier Diode, 1 Element, 0.5A, Silicon, HERMETIC SEALED PACKAGE-2

SUM35FSMSTX Parametric

Parameter NameAttribute value
package instructionO-XELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeO-XELF-R2
Number of components1
Number of terminals2
Maximum output current0.5 A
Package body materialUNSPECIFIED
Package shapeROUND
Package formLONG FORM
Certification statusNot Qualified
GuidelineMIL-19500
Maximum reverse recovery time0.18 µs
surface mountYES
Terminal formWRAP AROUND
Terminal locationEND
Base Number Matches1
Solid State Devices, Inc.
14701 Firestone Blvd * La Mirada, Ca 90638
Phone: (562) 404-7855 * Fax: (562) 404-1773
ssdi@ssdi-power.com * www.ssdi-power.com
SUM20F & FSMS
thru
SUM50F & FSMS
0.5 AMP
2000-5000 VOLTS
180 nsec
HIGH VOLTAGE
RECTIFIER
FEATURES:
Fast Recovery: 180 nsec Maximum
PIV to 5000 Volts
Hermetically Sealed Axial and Surface Mount
Package
Void-Free Construction
Metallurgically Bonded
175ºC Maximum Operating Temperature
TX, TXV, and Space Level Screening Available
2/
Designer’s Data Sheet
Part Number / Ordering Information
1/
SUM _ _ F
_ _ __
│ │ │
Screening
2/
__
= None
│ │ │
TX = TX Level
│ │ │
TXV = TXV Level
│ │ │
S = S Level
│ │ └
Package
___ = Axial
│ │
SMS = Surface Mount Square Tab
│ │
Recovery Time
│ └
F = Fast
Voltage
20 = 2000 V
25 = 2500 V
30 = 3000 V
35 = 3500 V
40 = 4000 V
50 = 5000 V
ELECTRICAL CHARACTERISTICS
Part
Number
Symbol
Units
Conditions
Peak
Inverse
Voltage
PIV
V
25ºC
25ºC
Average
Rectifier
Current
I
O
mA
100ºC
Maximum
Reverse Current
I
R
A
25ºC
@ PIV
100ºC
@ PIV
Maximum
Forward
Voltage
V
F
Volts
25ºC
@ I
O
Maximum
Surge
Current
(1 Cycle)
I
FSM
Amps
25ºC
8.3ms Pulse
Maximum
Reverse
Recovery
Time
t
RR
Nsec
25ºC
I
F
= 0.5 A
I
R
= 1.0 A
I
RR
= 0.25 A
Maximum
Junction
Capacitance
C
J
pF
25ºC
V
R
= 100 V
f
T
= 1 MHZ
Typical
Thermal
Impedance
R
θJL
/R
θJE
ºC/W
L = 3/8”
SUM20F
SUM25F
SUM30F
SUM35F
SUM40F
SUM50F
2000
2500
3000
3500
4000
5000
500
500
500
500
500
500
300
300
300
300
300
300
1.0
1.0
1.0
1.0
1.0
1.0
15
15
15
15
15
15
8
8
11
11
11
11
25
25
25
25
25
25
180
180
180
180
180
180
Axial
10
10
10
10
10
10
16
16
16
16
16
16
Surface Mount
Square Tab
1/ For Ordering Information, Price, and Availability – Contact Factory.
2/ Screening based on MIL-PRF-19500. Screening flows available on request.
3/ Operating and testing over 10,000 V/inch may require encapsulation or immersion in a
suitable dielectric material.
4/ Max. forward voltage measured with instantaneous forward pulse of 300µsec minimum.
5/ Max. Lead/End Tab temp. for soldering is 250°C, 3/8” from case for 5 sec maximum.
6/ Operating and storage temperature: -65°C to +175°C.
NOTE:
All specifications are subject to change without notification.
SCD's for these devices should be reviewed by SSDI prior to release.
DATA SHEET #: RC0038D
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