IC,SRAM,256X8,CMOS,DIP,40PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| memory density | 2048 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 8 |
| Number of ports | 2, (MUXED) |
| Number of terminals | 40 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MCM68HC34P | MCM68HC34FN | |
|---|---|---|
| Description | IC,SRAM,256X8,CMOS,DIP,40PIN,PLASTIC | IC,SRAM,256X8,CMOS,LDCC,44PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible |
| package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDIP-T40 | S-XQCC-J44 |
| JESD-609 code | e0 | e0 |
| memory density | 2048 bit | 2048 bit |
| Memory IC Type | MULTI-PORT SRAM | MULTI-PORT SRAM |
| memory width | 8 | 8 |
| Number of ports | 2, (MUXED) | 2, (MUXED) |
| Number of terminals | 40 | 44 |
| word count | 256 words | 256 words |
| character code | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C |
| organize | 256X8 | 256X8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ |
| Package shape | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD |
| Base Number Matches | 1 | 1 |
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