RJK0331DPB
Silicon N Channel Power MOS FET
Power Switching
REJ03G1640-0400
Rev.4.00
Apr 10, 2008
Features
High speed switching
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 2.6 m
Ω
typ. (at V
GS
= 10 V)
•
Pb-free
•
•
•
•
•
Outline
RENESAS Package code: PTZZ0005DA-A
(Package name: LFPAK)
5
D
5
4
G
3
12
4
1, 2, 3
4
5
Source
Gate
Drain
S S S
1 2 3
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body-drain diode reverse drain current
Avalanche current
Avalanche energy
Channel dissipation
Channel to Case Thermal Resistance
Channel temperature
Storage temperature
Notes: 1. PW
≤
10
µs,
duty cycle
≤
1%
2. Value at Tch = 25°C, Rg
≥
50
Ω
3. Tc = 25°C
Symbol
V
DSS
V
GSS
I
D
I
D(pulse)Note1
I
DR
I
AP Note 2
E
AR Note 2
Pch
Note3
Ratings
30
±20
40
160
40
20
40
50
2.5
150
–55 to +150
Unit
V
V
A
A
A
A
mJ
W
°C/W
°C
°C
θch-C
Tch
Tstg
REJ03G1640-0400 Rev.4.00 Apr 10, 2008
Page 1 of 6
RJK0331DPB
Electrical Characteristics
(Ta = 25°C)
Item
Drain to source breakdown
voltage
Gate to source leak current
Zero gate voltage drain current
Gate to source cutoff voltage
Static drain to source on state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate Resistance
Total gate charge
Gate to source charge
Gate to drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Body–drain diode forward voltage
Body–drain diode reverse
recovery time
Body–drain diode reverse
recovery charge
Notes: 4. Pulse test
Symbol
V
(BR)DSS
I
GSS
I
DSS
V
GS(off)
R
DS(on)
R
DS(on)
|y
fs
|
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
t
d(on)
t
r
t
d(off)
t
f
V
DF
t
rr
Q
rr
Min
30
—
—
1.2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
2.6
3.5
80
3380
660
190
0.6
22
7.8
4.8
5.8
3.9
45
4.6
0.82
30
26
Max
—
±0.1
1
2.5
3.4
4.9
—
—
—
—
—
—
—
—
—
—
—
—
1.07
—
—
Unit
V
µA
µA
V
mΩ
mΩ
S
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
V
ns
nC
Test Conditions
I
D
= 10 mA, V
GS
= 0
V
GS
=
±20
V, V
DS
= 0
V
DS
= 30 V, V
GS
= 0
V
DS
= 10 V, I
D
= 1 mA
I
D
= 20 A, V
GS
= 10 V
Note4
I
D
= 20 A, V
GS
= 4.5 V
Note4
I
D
= 20 A, V
DS
= 10 V
Note4
V
DS
= 10 V, V
GS
= 0,
f = 1 MHz
V
DD
= 10 V, V
GS
= 4.5 V,
I
D
= 40 A
V
GS
= 10 V, I
D
= 20 A,
V
DD
≅
10 V, R
L
= 0.5
Ω,
Rg = 4.7
Ω
I
F
= 40 A, V
GS
= 0
Note4
I
F
= 40 A, V
GS
= 0
di
F
/ dt = 100 A/
µs
REJ03G1640-0400 Rev.4.00 Apr 10, 2008
Page 2 of 6
RJK0331DPB
Main Characteristics
Power vs. Temperature Derating
80
1000
Maximum Safe Operation Area
Pch (W)
I
D
(A)
60
100
10
10
0
µ
s
Channel Dissipation
µ
s
Drain Current
40
10
1 ms
PW = 10 ms
Operation in
this area is
limited by R
DS(on)
DC
e
Op
20
1
ra
tio
n
0
50
100
150
200
Tc = 25°C
0.1 1 shot Pulse
0.1
1
10
100
Case Temperature
Tc (°C)
Drain to Source Voltage
V
DS
(V)
Typical Output Characteristics
50
4.5 V
10 V
Pulse Test
3.2 V
3.0 V
30
50
Typical Transfer Characteristics
V
DS
= 10 V
Pulse Test
I
D
(A)
I
D
(A)
Drain Current
40
40
30
Drain Current
20
2.8 V
20
25°C
Tc = 75°C
–25°C
10
V
GS
= 2.6 V
10
0
2
4
6
8
10
0
1
2
3
4
5
Drain to Source Voltage
V
DS
(V)
Gate to Source Voltage
V
GS
(V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
200
Static Drain to Source on State Resistance
vs. Drain Current
Drain to Source on State Resistance
R
DS (on)
(mΩ)
100
Pulse Test
Drain to Source Saturation Voltage
V
DS (on)
(mV)
Pulse Test
150
30
100
10
V
GS
= 4.5 V
3
10 V
1
1
50
I
D
= 20 A
10 A
5A
0
4
8
12
16
20
3
10
30
100
300 1000
Gate to Source Voltage
V
GS
(V)
Drain Current
I
D
(A)
REJ03G1640-0400 Rev.4.00 Apr 10, 2008
Page 3 of 6
RJK0331DPB
Static Drain to Source on State Resistance
vs. Temperature
10
Pulse Test
10000
3000
Static Drain to Source on State Resistance
R
DS (on)
(mΩ)
Typical Capacitance vs.
Drain to Source Voltage
Capacitance C (pF)
8
Ciss
1000
300
100
30
10
0
V
GS
= 0
f = 1 MHz
10
20
30
Coss
Crss
6
V
GS
= 4.5 V
I
D
= 5 A, 10 A, 20 A
4
2
0
–25
10 V
5 A, 10 A, 20 A
0
25
50
75
100 125 150
Case Temperature
Tc
(
°
C)
Drain to Source Voltage V
DS
(V)
Reverse Drain Current vs.
Source to Drain Voltage
V
GS
(V)
20
50
Dynamic Input Characteristics
V
DS
(V)
50
40
V
GS
V
DD
= 25 V
10 V
V
DS
Reverse Drain Current I
DR
(A)
I
D
= 40 A
Pulse Test
10 V
40
5V
16
Drain to Source Voltage
30
12
Gate to Source Voltage
30
20
8
20
V
GS
= 0, –5 V
10
V
DD
= 25 V
10 V
0
20
40
60
80
4
10
0
0
100
0
0.4
0.8
1.2
1.6
2.0
Gate Charge
Qg (nc)
Source to Drain Voltage V
SD
(V)
Maximum Avalanche Energy vs.
Channel Temperature Derating
Repetitive Avalanche Energy E
AR
(mJ)
100
I
AP
= 20 A
80
V
DD
= 15 V
duty < 0.1 %
Rg
≥
50
Ω
60
40
20
0
25
50
75
100
125
150
Channel Temperature Tch (°C)
REJ03G1640-0400 Rev.4.00 Apr 10, 2008
Page 4 of 6
RJK0331DPB
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
γ
s (t)
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
0.1
0.1
θch
– c (t) =
γ
s (t) •
θch
– c
θch
– c = 2.5°C/W, Tc = 25°C
P
DM
PW
T
1m
10 m
100 m
1
10
D=
PW
T
0.05
0.03
2
0.0
lse
1
t pu
0.0
ho
1s
0.01
10
µ
100
µ
Pulse Width PW (s)
Avalanche Test Circuit
Avalanche Waveform
1
2
L
•
I
AP2
•
V
DSS
V
DSS
– V
DD
V
(BR)DSS
I
AP
V
DD
V
DS
V
DS
Monitor
L
I
AP
Monitor
E
AR
=
Rg
D. U. T
I
D
Vin
15 V
50
Ω
0
V
DD
Switching Time Test Circuit
Vin Monitor
D.U.T.
Rg
R
L
V
DS
= 10 V
Vin
Vout
Vin
10 V
Vout
Monitor
Switching Time Waveform
90%
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
REJ03G1640-0400 Rev.4.00 Apr 10, 2008
Page 5 of 6
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