EEWORLDEEWORLDEEWORLD

Part Number

Search

BB502CBS-TL-E

Description
Built in Biasing Circuit MOS FET IC UHF RF Amplifier
CategoryDiscrete semiconductor    The transistor   
File Size112KB,11 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

BB502CBS-TL-E Overview

Built in Biasing Circuit MOS FET IC UHF RF Amplifier

BB502CBS-TL-E Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeSC-82
package instructionSMALL OUTLINE, R-PDSO-G4
Contacts4
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresLOW NOISE
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage6 V
Maximum drain current (Abs) (ID)0.02 A
Maximum drain current (ID)0.02 A
FET technologyMETAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss)0.05 pF
highest frequency bandULTRA HIGH FREQUENCY BAND
JESD-30 codeR-PDSO-G4
Humidity sensitivity level1
Number of components1
Number of terminals4
Operating modeDUAL GATE, DEPLETION MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.1 W
Minimum power gain (Gp)17 dB
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature20
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
BB502C
Built in Biasing Circuit MOS FET IC
UHF RF Amplifier
REJ03G0832-0600
(Previous ADE-208-810C)
Rev.6.00
Apr 27, 2006
Features
Built in Biasing Circuit; To reduce using parts cost & PC board space.
Low noise; NF = 1.6 dB typ. at f = 900 MHz
High gain; PG = 22 dB typ. at f = 900 MHz
Withstanding to ESD;
Built in ESD absorbing diode. Withstand up to 200V at C=200pF, Rs=0 conditions.
Provide mini mold packages; CMPAK-4(SOT-343mod)
Outline
RENESAS Package code: PTSP0004ZA-A
(Package name: CMPAK-4)
2
3
1
4
1. Source
2. Gate1
3. Gate2
4. Drain
Notes:
1. Marking is “BS–”.
2. BB502C is individual type number of RENESAS BBFET.
Rev.6.00 Apr 27, 2006 page 1 of 10

BB502CBS-TL-E Related Products

BB502CBS-TL-E BB502C
Description Built in Biasing Circuit MOS FET IC UHF RF Amplifier Built in Biasing Circuit MOS FET IC UHF RF Amplifier
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code SC-82 SC-82
package instruction SMALL OUTLINE, R-PDSO-G4 SMALL OUTLINE, R-PDSO-G4
Contacts 4 4
Reach Compliance Code unknow compli
ECCN code EAR99 EAR99
Other features LOW NOISE LOW NOISE
Configuration SINGLE WITH BUILT-IN DIODE SINGLE
Minimum drain-source breakdown voltage 6 V 6 V
Maximum drain current (Abs) (ID) 0.02 A 0.02 A
Maximum drain current (ID) 0.02 A 0.02 A
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss) 0.05 pF 0.05 pF
highest frequency band ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 code R-PDSO-G4 R-PDSO-G4
Humidity sensitivity level 1 1
Number of components 1 1
Number of terminals 4 4
Operating mode DUAL GATE, DEPLETION MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 0.1 W 0.1 W
Minimum power gain (Gp) 17 dB 17 dB
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 20 NOT SPECIFIED
transistor applications AMPLIFIER AMPLIFIER
Transistor component materials SILICON SILICON
I would like to ask an expert for the knowledge of active probe of reversing radar
I would like to ask you guys, what are the advantages and disadvantages of active ultrasonic probes compared to passive ones, I would be very grateful!!!...
wzzhc Automotive Electronics
The program in the 6852 driver library cannot be burned into the chip???
As the title says!! I just downloaded the latest driver library of luminary but after debugging it, I found that it cannot be burned! The following situation occurs when burning! I burned the program ...
历史的天空 Microcontroller MCU
Who has the detailed information of 12864! ?
Can anyone give me the detailed information of LCD 12864? Thanks! 812150818@qq.com...
812150818 DIY/Open Source Hardware
Design of Switching Power Supply Circuit for Lightning Surge Protection
Central topics: Lightning Surge AnalysisDesign of lightning surge protection circuit Solution: Application: Single-phase parallel connection of varistor and ceramic gas discharge tubeUsing wirewound r...
LED123 Power technology
About the standby problem ~ puzzled ~ request help
I am going to do micro power consumption of stm32 recently. After reading some information, people said that the standby mode of stm32 has the lowest power consumption. So I want to understand the sta...
zxhnet stm32/stm8
Samsung Galaxy S6 edge China Edition unboxing (many high-definition pictures provided)
It's been a while since I saw you guys posting unboxing posts in this section. Today, it just so happened that a colleague of mine bought me a popular dual-curved screen phone, the Samsung Galaxy S6 e...
eric_wang Mobile and portable

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1421  1070  331  2688  422  29  22  7  55  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号