M34524MC-XXXFP datasheet, PDF - EEWORLD Datasheet

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M34524MC-XXXFP: Description4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，310 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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M34524MC-XXXFP Overview

4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES

M34524MC-XXXFP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
package instruction	QFP, QFP64,.66SQ,32
Contacts	64
Reach Compliance Code	unknow
Has ADC	YES
Other features	ALSO OPERATES AT 2V MINIMUM SUPPLY
Address bus width
bit size	4
CPU series	4500
maximum clock frequency	6 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G64
JESD-609 code	e2
length	14 mm
Humidity sensitivity level	3
Number of I/O lines	31
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP64,.66SQ,32
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	245
power supply	2.5/5 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	12288
ROM programmability	MROM
Maximum seat height	3.05 mm
speed	6 MHz
Maximum slew rate	5.6 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN COPPER
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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REJ09B0107-0200Z

4

4524 Group

User's Manual

RENESAS 4-BIT CISC SINGLE-CHIP MICROCOMPUTER

720 FAMILY / 4500 SERIES

Before using this material, please visit our website to confirm that this is the most

current document available.

Rev. 2.00

Revision date: Aug 06, 2004

www.renesas.com

Keep safety first in your circuit designs!

1.

Renesas Technology Corp. puts the maximum effort into making semiconductor products

better and more reliable, but there is always the possibility that trouble may occur with

them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with ap-

propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-

flammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1.

2.

3.

4.

5.

6.

7.

8.

These materials are intended as a reference to assist our customers in the selection of the

Renesas Technology Corp. product best suited to the customer's application; they do not

convey any license under any intellectual property rights, or any other rights, belonging to

Renesas Technology Corp. or a third party.

Renesas Technology Corp. assumes no responsibility for any damage, or infringement of

any third-party's rights, originating in the use of any product data, diagrams, charts, pro-

grams, algorithms, or circuit application examples contained in these materials.

All information contained in these materials, including product data, diagrams, charts, pro-

grams and algorithms represents information on products at the time of publication of these

materials, and are subject to change by Renesas Technology Corp. without notice due to

product improvements or other reasons. It is therefore recommended that customers con-

tact Renesas Technology Corp. or an authorized Renesas Technology Corp. product dis-

tributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other

loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by vari-

ous means, including the Renesas Technology Corp. Semiconductor home page (http://

www.renesas.com).

When using any or all of the information contained in these materials, including product

data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-

tion as a total system before making a final decision on the applicability of the information

and products. Renesas Technology Corp. assumes no responsibility for any damage, liabil-

ity or other loss resulting from the information contained herein.

Renesas Technology Corp. semiconductors are not designed or manufactured for use in a

device or system that is used under circumstances in which human life is potentially at

stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology

Corp. product distributor when considering the use of a product contained herein for any

specific purposes, such as apparatus or systems for transportation, vehicular, medical,

aerospace, nuclear, or undersea repeater use.

The prior written approval of Renesas Technology Corp. is necessary to reprint or repro-

duce in whole or in part these materials.

If these products or technologies are subject to the Japanese export control restrictions,

they must be exported under a license from the Japanese government and cannot be im-

ported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/

or the country of destination is prohibited.

Please contact Renesas Technology Corp. for further details on these materials or the

products contained therein.

4524 Group

Table of contents

Table of contents

CHAPTER 1 HARDWARE

DESCRIPTION ................................................................................................................................... 2

FEATURES ......................................................................................................................................... 2

APPLICATION ................................................................................................................................... 2

PIN CONFIGURATION ..................................................................................................................... 3

BLOCK DIAGRAM ............................................................................................................................ 4

PERFORMANCE OVERVIEW .......................................................................................................... 5

PIN DESCRIPTION ........................................................................................................................... 6

MULTIFUNCTION ........................................................................................................................ 7

DEFINITION OF CLOCK AND CYCLE .................................................................................... 7

PORT FUNCTION ....................................................................................................................... 8

CONNECTIONS OF UNUSED PINS ........................................................................................ 9

PORT BLOCK DIAGRAMS ...................................................................................................... 10

FUNCTION BLOCK OPERATIONS .............................................................................................. 18

CPU ............................................................................................................................................. 18

PROGRAM MEMORY (ROM) .................................................................................................. 21

DATA MEMORY (RAM) ............................................................................................................ 22

INTERRUPT FUNCTION .......................................................................................................... 23

EXTERNAL INTERRUPTS ....................................................................................................... 27

TIMERS ...................................................................................................................................... 32

WATCHDOG TIMER ................................................................................................................. 45

A/D CONVERTER (COMPARATOR) ...................................................................................... 47

SERIAL I/O ................................................................................................................................. 53

LCD FUNCTION ........................................................................................................................ 57

RESET FUNCTION ................................................................................................................... 62

VOLTAGE DROP DETECTION CIRCUIT .............................................................................. 66

POWER DOWN FUNCTION .................................................................................................... 67

CLOCK CONTROL .................................................................................................................... 72

ROM ORDERING METHOD .......................................................................................................... 74

LIST OF PRECAUTIONS ............................................................................................................... 75

CONTROL REGISTERS ................................................................................................................. 79

INSTRUCTIONS ............................................................................................................................... 86

SYMBOL ..................................................................................................................................... 86

INDEX LIST OF INSTRUCTION FUNCTION ........................................................................ 87

MACHINE INSTRUCTIONS (INDEX BY ALPHABET) .......................................................... 92

MACHINE INSTRUCTIONS (INDEX BY TYPES) (CONTINUED) ..................................... 132

INSTRUCTION CODE TABLE ............................................................................................... 148

BUILT-IN PROM VERSION ......................................................................................................... 150

Rev.2.00 Aug, 06 2004

REJ09B0107-0200Z

i

M34524MC-XXXFP Related Products

	M34524MC-XXXFP	4524	4524_M	M34524M8-XXXFP	M34524EDFP
Description	4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES	4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES	4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES	4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES	4-BIT CISC SINGLE-CHIP MICROCOMPUTER 720 FAMILY / 4500 SERIES
Maker	Renesas Electronics Corporation	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	QFP	-	-	QFP	QFP
package instruction	QFP, QFP64,.66SQ,32	-	-	QFP, QFP64,.66SQ,32	14 X 14 MM, 0.80 MM PITCH, PLASTIC, QFP-64
Contacts	64	-	-	64	64
Reach Compliance Code	unknow	-	-	unknow	compli
Has ADC	YES	-	-	YES	YES
Other features	ALSO OPERATES AT 2V MINIMUM SUPPLY	-	-	ALSO OPERATES AT 2V MINIMUM SUPPLY	ALSO OPERATES AT 2.5V MINIMUM SUPPLY
bit size	4	-	-	4	4
CPU series	4500	-	-	4500	4500
maximum clock frequency	6 MHz	-	-	6 MHz	6 MHz
DAC channel	NO	-	-	NO	NO
DMA channel	NO	-	-	NO	NO
JESD-30 code	S-PQFP-G64	-	-	S-PQFP-G64	S-PQFP-G64
length	14 mm	-	-	14 mm	14 mm
Number of I/O lines	31	-	-	31	31
Number of terminals	64	-	-	64	64
Maximum operating temperature	85 °C	-	-	85 °C	85 °C
Minimum operating temperature	-20 °C	-	-	-20 °C	-20 °C
PWM channel	YES	-	-	YES	YES
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	-	-	QFP	QFP
Encapsulate equivalent code	QFP64,.66SQ,32	-	-	QFP64,.66SQ,32	QFP64,.66SQ,32
Package shape	SQUARE	-	-	SQUARE	SQUARE
Package form	FLATPACK	-	-	FLATPACK	FLATPACK
power supply	2.5/5 V	-	-	2.5/5 V	3/5 V
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified
RAM (bytes)	512	-	-	512	512
rom(word)	12288	-	-	8192	16384
ROM programmability	MROM	-	-	MROM	OTPROM
Maximum seat height	3.05 mm	-	-	3.05 mm	3.05 mm
speed	6 MHz	-	-	6 MHz	6 MHz
Maximum slew rate	5.6 mA	-	-	5.6 mA	5.6 mA
Maximum supply voltage	5.5 V	-	-	5.5 V	5.5 V
Minimum supply voltage	4 V	-	-	4 V	4 V
Nominal supply voltage	5 V	-	-	5 V	5 V
surface mount	YES	-	-	YES	YES
technology	CMOS	-	-	CMOS	CMOS
Temperature level	OTHER	-	-	OTHER	OTHER
Terminal form	GULL WING	-	-	GULL WING	GULL WING
Terminal pitch	0.8 mm	-	-	0.8 mm	0.8 mm
Terminal location	QUAD	-	-	QUAD	QUAD
width	14 mm	-	-	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	-	MICROCONTROLLER	MICROCONTROLLER

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