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LG1626DXC

Description
ATM/SONET/SDH SUPPORT CIRCUIT, QFP24, HERMETIC SEALED PACKAGE-24
CategoryWireless rf/communication    Telecom circuit   
File Size283KB,10 Pages
ManufacturerAVAGO
Websitehttp://www.avagotech.com/
Download Datasheet Parametric Compare View All

LG1626DXC Overview

ATM/SONET/SDH SUPPORT CIRCUIT, QFP24, HERMETIC SEALED PACKAGE-24

LG1626DXC Parametric

Parameter NameAttribute value
package instructionQFP,
Reach Compliance Codeunknown
JESD-30 codeS-XQFP-G24
JESD-609 codee0
length7 mm
Negative supply voltage rating-5.2 V
Number of functions1
Number of terminals24
Package body materialUNSPECIFIED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height2.0828 mm
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width7 mm
Base Number Matches1

LG1626DXC Related Products

LG1626DXC
Description ATM/SONET/SDH SUPPORT CIRCUIT, QFP24, HERMETIC SEALED PACKAGE-24
package instruction QFP,
Reach Compliance Code unknown
JESD-30 code S-XQFP-G24
JESD-609 code e0
length 7 mm
Negative supply voltage rating -5.2 V
Number of functions 1
Number of terminals 24
Package body material UNSPECIFIED
encapsulated code QFP
Package shape SQUARE
Package form FLATPACK
Peak Reflow Temperature (Celsius) 240
Certification status Not Qualified
Maximum seat height 2.0828 mm
surface mount YES
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Terminal surface TIN LEAD
Terminal form GULL WING
Terminal pitch 0.8 mm
Terminal location QUAD
Maximum time at peak reflow temperature 30
width 7 mm
Base Number Matches 1

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