ATM/SONET/SDH SUPPORT CIRCUIT, QFP24, HERMETIC SEALED PACKAGE-24
| Parameter Name | Attribute value |
| package instruction | QFP, |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQFP-G24 |
| JESD-609 code | e0 |
| length | 7 mm |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of terminals | 24 |
| Package body material | UNSPECIFIED |
| encapsulated code | QFP |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 2.0828 mm |
| surface mount | YES |
| Telecom integrated circuit types | ATM/SONET/SDH SUPPORT CIRCUIT |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 7 mm |
| Base Number Matches | 1 |
| LG1626DXC | |
|---|---|
| Description | ATM/SONET/SDH SUPPORT CIRCUIT, QFP24, HERMETIC SEALED PACKAGE-24 |
| package instruction | QFP, |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQFP-G24 |
| JESD-609 code | e0 |
| length | 7 mm |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of terminals | 24 |
| Package body material | UNSPECIFIED |
| encapsulated code | QFP |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 2.0828 mm |
| surface mount | YES |
| Telecom integrated circuit types | ATM/SONET/SDH SUPPORT CIRCUIT |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 7 mm |
| Base Number Matches | 1 |