16-BIT, 10MHz, MICROPROCESSOR, PQCC52, PLASTIC, LCC-52
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | LCC |
| package instruction | PLASTIC, LCC-52 |
| Contacts | 52 |
| Reach Compliance Code | not_compliant |
| Address bus width | 22 |
| bit size | 16 |
| boundary scan | NO |
| maximum clock frequency | 10 MHz |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | S-PQCC-J52 |
| JESD-609 code | e0 |
| length | 19.1262 mm |
| low power mode | NO |
| Number of DMA channels | |
| Number of external interrupt devices | 7 |
| Number of serial I/Os | |
| Number of terminals | 52 |
| On-chip data RAM width | |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC52,.8SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum seat height | 5.08 mm |
| speed | 10 MHz |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | NMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.1262 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |

| TS68008CFN10 | TS68008CP10 | TS68008CP8 | TS68008VFN10 | |
|---|---|---|---|---|
| Description | 16-BIT, 10MHz, MICROPROCESSOR, PQCC52, PLASTIC, LCC-52 | 16-BIT, 10MHz, MICROPROCESSOR, PDIP48, PLASTIC, DIP-48 | 16-BIT, 8MHz, MICROPROCESSOR, PDIP48, PLASTIC, DIP-48 | 16-BIT, 10MHz, MICROPROCESSOR, PQCC52, PLASTIC, LCC-52 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | LCC | DIP | DIP | LCC |
| package instruction | PLASTIC, LCC-52 | PLASTIC, DIP-48 | PLASTIC, DIP-48 | PLASTIC, LCC-52 |
| Contacts | 52 | 48 | 48 | 52 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| Address bus width | 22 | 20 | 20 | 22 |
| bit size | 16 | 16 | 16 | 16 |
| boundary scan | NO | NO | NO | NO |
| maximum clock frequency | 10 MHz | 10 MHz | 8 MHz | 10 MHz |
| External data bus width | 8 | 8 | 8 | 8 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO |
| JESD-30 code | S-PQCC-J52 | R-PDIP-T48 | R-PDIP-T48 | S-PQCC-J52 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| low power mode | NO | NO | NO | NO |
| Number of external interrupt devices | 7 | 3 | 3 | 7 |
| Number of terminals | 52 | 48 | 48 | 52 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | DIP | QCCJ |
| Encapsulate equivalent code | LDCC52,.8SQ | DIP48,.6 | DIP48,.6 | LDCC52,.8SQ |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| speed | 10 MHz | 10 MHz | 8 MHz | 10 MHz |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES |
| technology | NMOS | NMOS | NMOS | NMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 19.1262 mm | 15.24 mm | 15.24 mm | 19.1262 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 |