KM69B257P-20 datasheet, PDF - EEWORLD Datasheet

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KM69B257P-20: DescriptionCache SRAM, 32KX9, 20ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size162KB，7 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM69B257P-20 Overview

Cache SRAM, 32KX9, 20ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32

KM69B257P-20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP32,.3
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A991.B.2.B
Maximum access time	20 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	39.93 mm
memory density	294912 bit
Memory IC Type	CACHE SRAM
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.25 mm
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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KM69B257P-20 Related Products

	KM69B257P-20	KM69B257P-12	KM69B257J-10	KM69B257P-10	KM69B257J-12	KM69B257J-15	KM69B257J-20	KM69B257P-15
Description	Cache SRAM, 32KX9, 20ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Cache SRAM, 32KX9, 12ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Cache SRAM, 32KX9, 10ns, BICMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Cache SRAM, 32KX9, 10ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32	Cache SRAM, 32KX9, 12ns, BICMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Cache SRAM, 32KX9, 15ns, BICMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Cache SRAM, 32KX9, 20ns, BICMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Cache SRAM, 32KX9, 15ns, BICMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	SOJ	DIP	SOJ	SOJ	SOJ	DIP
package instruction	DIP, DIP32,.3	DIP, DIP32,.3	SOJ, SOJ32,.34	DIP, DIP32,.3	SOJ, SOJ32,.34	SOJ, SOJ32,.34	SOJ, SOJ32,.34	DIP, DIP32,.3
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	20 ns	12 ns	10 ns	10 ns	12 ns	15 ns	20 ns	15 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T32	R-PDIP-T32	R-PDSO-J32	R-PDIP-T32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32	R-PDIP-T32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	39.93 mm	39.93 mm	20.96 mm	39.93 mm	20.96 mm	20.96 mm	20.96 mm	39.93 mm
memory density	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit	294912 bit
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9	32KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOJ	DIP	SOJ	SOJ	SOJ	DIP
Encapsulate equivalent code	DIP32,.3	DIP32,.3	SOJ32,.34	DIP32,.3	SOJ32,.34	SOJ32,.34	SOJ32,.34	DIP32,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.25 mm	5.25 mm	3.57 mm	5.25 mm	3.57 mm	3.57 mm	3.57 mm	5.25 mm
Maximum slew rate	0.13 mA	0.175 mA	0.195 mA	0.195 mA	0.175 mA	0.155 mA	0.13 mA	0.155 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES	YES	YES	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	J BEND	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.397 mm	2.54 mm	1.397 mm	1.397 mm	1.397 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Maker	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG

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