DG41_C_ ..............................................................0°C to +70°C
DG41_D_ ...........................................................-40°C to +85°C
DG41_AK_ .......................................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Signals on S, D, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward current to maximum
current rating.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
This is a structure in the development of stm32 USB module. I don’t know the specific function of this structure. Please give me some advice~~~ typedef struct _DEVICE_INFO { uint8_t USBbmRequestType; ...
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stm32/stm8
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