AT25DF081-SSHN-T datasheet, PDF

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AT25DF081-SSHN-T: Description8-megabit 1.65-volt Minimum SPI Serial Flash Memory; Categorystorage storage; File Size633KB，38 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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AT25DF081-SSHN-T Overview

8-megabit 1.65-volt Minimum SPI Serial Flash Memory

AT25DF081-SSHN-T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Atmel (Microchip)
Parts packaging code	SOIC
package instruction	0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum clock frequency (fCLK)	66 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	4.925 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	8
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
power supply	1.8 V
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
Serial bus type	SPI
Maximum standby current	0.000014 A
Maximum slew rate	0.017 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
type	NOR TYPE
width	3.9 mm
write protect	HARDWARE/SOFTWARE

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Features

•

Single 1.65V - 1.95V Supply

•

Serial Peripheral Interface (SPI) Compatible

•

– Supports SPI Modes 0 and 3

66 MHz Maximum Clock Frequency

Flexible, Uniform Erase Architecture

– 4-Kbyte Blocks

– 32-Kbyte Blocks

– 64-Kbyte Blocks

– Full Chip Erase

Individual Sector Protection with Global Protect/Unprotect Feature

– Sixteen 64-Kbyte Physical Sectors

Hardware Controlled Locking of Protected Sectors

Flexible Programming

– Byte/Page Program (1 to 256 Bytes)

Automatic Checking and Reporting of Erase/Program Failures

JEDEC Standard Manufacturer and Device ID Read Methodology

Low Power Dissipation

– 7 mA Active Read Current (Typical)

– 8 µA Deep Power-Down Current (Typical)

Endurance: 100,000 Program/Erase Cycles

Data Retention: 20 Years

Complies with Full Industrial Temperature Range

Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

– 8-lead SOIC (150-mil wide)

– 8-contact Ultra Thin DFN (5 mm x 6 mm x 0.6 mm)

– 11-ball dBGA (WLCSP)

•

8-megabit

1.65-volt

Minimum

SPI Serial Flash

Memory

AT25DF081

•

1. Description

The AT25DF081 is a serial interface Flash memory device designed for use in a wide

variety of high-volume consumer based applications in which program code is shad-

owed from Flash memory into embedded or external RAM for execution. The flexible

erase architecture of the AT25DF081, with its erase granularity as small as 4-Kbytes,

makes it ideal for data storage as well, eliminating the need for additional data storage

EEPROM devices.

The physical sectoring and the erase block sizes of the AT25DF081 have been opti-

mized to meet the needs of today's code and data storage applications. By optimizing

the size of the physical sectors and erase blocks, the memory space can be used

much more efficiently. Because certain code modules and data storage segments

must reside by themselves in their own protected sectors, the wasted and unused

memory space that occurs with large sectored and large block erase Flash memory

devices can be greatly reduced. This increased memory space efficiency allows addi-

tional code routines and data storage segments to be added while still maintaining the

same overall device density.

3674E–DFLASH–8/08

AT25DF081

2. Pin Descriptions and Pinouts

Table 2-1.

Symbol

Pin Descriptions

Name and Function

CHIP SELECT:

Asserting the CS pin selects the device. When the CS pin is deasserted, the

device will be deselected and normally be placed in standby mode (not Deep Power-Down mode),

and the SO pin will be in a high-impedance state. When the device is deselected, data will not be

accepted on the SI pin.

A high-to-low transition on the CS pin is required to start an operation, and a low-to-high transition

is required to end an operation. When ending an internally self-timed operation such as a program

or erase cycle, the device will not enter the standby mode until the completion of the operation.

SERIAL CLOCK:

This pin is used to provide a clock to the device and is used to control the flow of

data to and from the device. Command, address, and input data present on the SI pin is always

latched on the rising edge of SCK, while output data on the SO pin is always clocked out on the

falling edge of SCK.

SERIAL INPUT:

The SI pin is used to shift data into the device. The SI pin is used for all data input

including command and address sequences. Data on the SI pin is always latched on the rising

edge of SCK.

SERIAL OUTPUT:

The SO pin is used to shift data out from the device. Data on the SO pin is

always clocked out on the falling edge of SCK.

WRITE PROTECT:

The WP pin controls the hardware locking feature of the device. Please refer to

“Protection Commands and Features” on page 12

for more details on protection features and the

WP pin.

The WP pin is internally pulled-high and may be left floating if hardware controlled protection will

not be used. However, it is recommended that the WP pin also be externally connected to V

whenever possible.

HOLD:

The HOLD pin is used to temporarily pause serial communication without deselecting or

resetting the device. While the HOLD pin is asserted, transitions on the SCK pin and data on the SI

pin will be ignored, and the SO pin will be in a high-impedance state.

The CS pin must be asserted, and the SCK pin must be in the low state in order for a Hold

condition to start. A Hold condition pauses serial communication only and does not have an effect

on internally self-timed operations such as a program or erase cycle. Please refer to

“Hold” on

page 27

for additional details on the Hold operation.

The HOLD pin is internally pulled-high and may be left floating if the Hold function will not be used.

However, it is recommended that the HOLD pin also be externally connected to V

whenever

possible.

DEVICE POWER SUPPLY:

The V

pin is used to supply the source voltage to the device.

Operations at invalid V

voltages may produce spurious results and should not be attempted.

GROUND:

The ground reference for the power supply. GND should be connected to the system

ground.

Asserted

State

Type

Low

Input

SCK

Input

Output

Low

Input

HOLD

Low

Input

GND

Power

3674E–DFLASH–8/08

AT25DF081-SSHN-T Related Products

	AT25DF081-SSHN-T	AT25DF081	AT25DF081-MHN-Y
Description	8-megabit 1.65-volt Minimum SPI Serial Flash Memory	8-megabit 1.65-volt Minimum SPI Serial Flash Memory	8-megabit 1.65-volt Minimum SPI Serial Flash Memory
Is it Rohs certified?	conform to	-	conform to
Maker	Atmel (Microchip)	-	Atmel (Microchip)
Parts packaging code	SOIC	-	SON
package instruction	0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8	-	HVSON, SOLCC8,.2
Contacts	8	-	8
Reach Compliance Code	unknow	-	compli
ECCN code	EAR99	-	EAR99
Maximum clock frequency (fCLK)	66 MHz	-	66 MHz
Data retention time - minimum	20	-	20
Durability	100000 Write/Erase Cycles	-	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	-	R-PDSO-N8
JESD-609 code	e4	-	e4
length	4.925 mm	-	6 mm
memory density	8388608 bi	-	8388608 bi
Memory IC Type	FLASH	-	FLASH
memory width	8	-	8
Number of functions	1	-	1
Number of terminals	8	-	8
word count	1048576 words	-	1048576 words
character code	1000000	-	1000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-	-40 °C
organize	1MX8	-	1MX8
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	SOP	-	HVSON
Encapsulate equivalent code	SOP8,.25	-	SOLCC8,.2
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	-	SERIAL
power supply	1.8 V	-	1.8 V
Programming voltage	1.8 V	-	1.8 V
Certification status	Not Qualified	-	Not Qualified
Maximum seat height	1.75 mm	-	0.6 mm
Serial bus type	SPI	-	SPI
Maximum standby current	0.000014 A	-	0.000014 A
Maximum slew rate	0.017 mA	-	0.017 mA
Maximum supply voltage (Vsup)	1.95 V	-	1.95 V
Minimum supply voltage (Vsup)	1.65 V	-	1.65 V
Nominal supply voltage (Vsup)	1.8 V	-	1.8 V
surface mount	YES	-	YES
technology	CMOS	-	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	-	NO LEAD
Terminal pitch	1.27 mm	-	1.27 mm
Terminal location	DUAL	-	DUAL
type	NOR TYPE	-	NOR TYPE
width	3.9 mm	-	5 mm
write protect	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE

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