Multiplexers/Switches, 4 Func, CMOS, PDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NC |
| Number of functions | 4 |
| Number of terminals | 16 |
| Maximum on-state resistance (Ron) | 250 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| output | SEPARATE OUTPUT |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum connection time | 600 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DG201ACJ | DG201ABK | DG201ADY | DG201ACK | DG201AAK | |
|---|---|---|---|---|---|
| Description | Multiplexers/Switches, 4 Func, CMOS, PDIP16 | Multiplexers/Switches, 4 Func, CMOS, CDIP16 | Multiplexers/Switches, 4 Func, CMOS, PDSO16, | Multiplexers/Switches, 4 Func, CMOS, CDIP16 | Multiplexers/Switches, 4 Func, CMOS, CDIP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| normal position | NC | NC | NC | NC | NC |
| Number of functions | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum on-state resistance (Ron) | 250 Ω | 250 Ω | 250 Ω | 250 Ω | 250 Ω |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C | 125 °C |
| Minimum operating temperature | - | -25 °C | -40 °C | - | -55 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | YES | NO | NO |
| Maximum connection time | 600 ns | 600 ns | 600 ns | 600 ns | 600 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | OTHER | INDUSTRIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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