AT27LV1024-30PC datasheet, PDF

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AT27LV1024-30PC: DescriptionOTP ROM, 64KX16, 300ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40; Categorystorage storage; File Size227KB，8 Pages; ManufacturerAtmel (Microchip)

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AT27LV1024-30PC Overview

OTP ROM, 64KX16, 300ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40

AT27LV1024-30PC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP40,.6
Contacts	40
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	300 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
length	52.2 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	16
Number of functions	1
Number of terminals	40
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5,5 V
Certification status	Not Qualified
Maximum seat height	5.59 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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AT27LV1024-30PC Related Products

	AT27LV1024-30PC	AT27LV1024-30DI	AT27LV1024-25KC	AT27LV1024-25KI	AT27LV1024-30DC	AT27LV1024-30JC	AT27LV1024-30KC	AT27LV1024-30KI	AT27LV1024-30LI	AT27LV1024-30LC
Description	OTP ROM, 64KX16, 300ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	UVPROM, 64KX16, 300ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	OTP ROM, 64KX16, 300ns, CMOS, PQCC44, PLASTIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CQCC44, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CQCC44, CERAMIC, LCC-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	LCC	LCC	DIP	LCC	LCC	LCC	LCC	LCC
package instruction	DIP, DIP40,.6	WDIP, DIP40,.6	WQCCJ, LDCC44,.7SQ	WQCCJ, LDCC44,.7SQ	WDIP, DIP40,.6	PLASTIC, LCC-44	WQCCJ, LDCC44,.7SQ	WQCCJ, LDCC44,.7SQ	QCCN, LCC44,.65SQ	QCCN, LCC44,.65SQ
Contacts	40	40	44	44	40	44	44	44	44	44
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown	compliant	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	300 ns	300 ns	250 ns	250 ns	300 ns	300 ns	300 ns	300 ns	300 ns	300 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T40	R-GDIP-T40	S-CQCC-J44	S-CQCC-J44	R-GDIP-T40	S-PQCC-J44	S-CQCC-J44	S-CQCC-J44	S-CQCC-N44	S-CQCC-N44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	52.2 mm	52.45 mm	16.65 mm	16.65 mm	52.45 mm	16.5862 mm	16.65 mm	16.65 mm	16.55 mm	16.55 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	UVPROM	UVPROM	UVPROM	UVPROM	OTP ROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	16	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	40	40	44	44	40	44	44	44	44	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C	70 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	WDIP	WQCCJ	WQCCJ	WDIP	QCCJ	WQCCJ	WQCCJ	QCCN	QCCN
Encapsulate equivalent code	DIP40,.6	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LCC44,.65SQ	LCC44,.65SQ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	225	225	NOT SPECIFIED	225	225	225	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.59 mm	5.72 mm	4.57 mm	4.57 mm	5.72 mm	4.57 mm	4.57 mm	4.57 mm	2.74 mm	2.74 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.03 mA	0.04 mA	0.03 mA	0.04 mA	0.03 mA	0.03 mA	0.03 mA	0.04 mA	0.04 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	J BEND	J BEND	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	16.65 mm	16.65 mm	15.24 mm	16.5862 mm	16.65 mm	16.65 mm	16.55 mm	16.55 mm
Base Number Matches	1	1	1	1	1	1	1	1	-	-

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