AT27LV1024-30KC datasheet, PDF

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AT27LV1024-30KC: DescriptionUVPROM, 64KX16, 300ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44; Categorystorage storage; File Size227KB，8 Pages; ManufacturerAtmel (Microchip)

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AT27LV1024-30KC Overview

UVPROM, 64KX16, 300ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44

AT27LV1024-30KC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	LCC
package instruction	WQCCJ, LDCC44,.7SQ
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	300 ns
I/O type	COMMON
JESD-30 code	S-CQCC-J44
JESD-609 code	e0
length	16.65 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of terminals	44
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3/5,5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.65 mm
Base Number Matches	1

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	AT27LV1024-30KC	AT27LV1024-30DI	AT27LV1024-25KC	AT27LV1024-25KI	AT27LV1024-30DC	AT27LV1024-30JC	AT27LV1024-30KI	AT27LV1024-30PC	AT27LV1024-30LI	AT27LV1024-30LC
Description	UVPROM, 64KX16, 300ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	OTP ROM, 64KX16, 300ns, CMOS, PQCC44, PLASTIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44	OTP ROM, 64KX16, 300ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40	UVPROM, 64KX16, 300ns, CMOS, CQCC44, CERAMIC, LCC-44	UVPROM, 64KX16, 300ns, CMOS, CQCC44, CERAMIC, LCC-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	DIP	LCC	LCC	DIP	LCC	LCC	DIP	LCC	LCC
package instruction	WQCCJ, LDCC44,.7SQ	WDIP, DIP40,.6	WQCCJ, LDCC44,.7SQ	WQCCJ, LDCC44,.7SQ	WDIP, DIP40,.6	PLASTIC, LCC-44	WQCCJ, LDCC44,.7SQ	DIP, DIP40,.6	QCCN, LCC44,.65SQ	QCCN, LCC44,.65SQ
Contacts	44	40	44	44	40	44	44	40	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	compliant	unknown	compliant	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	300 ns	300 ns	250 ns	250 ns	300 ns	300 ns	300 ns	300 ns	300 ns	300 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CQCC-J44	R-GDIP-T40	S-CQCC-J44	S-CQCC-J44	R-GDIP-T40	S-PQCC-J44	S-CQCC-J44	R-PDIP-T40	S-CQCC-N44	S-CQCC-N44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	16.65 mm	52.45 mm	16.65 mm	16.65 mm	52.45 mm	16.5862 mm	16.65 mm	52.2 mm	16.55 mm	16.55 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	OTP ROM	UVPROM	OTP ROM	UVPROM	UVPROM
memory width	16	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	44	40	44	44	40	44	44	40	44	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCJ	WDIP	WQCCJ	WQCCJ	WDIP	QCCJ	WQCCJ	DIP	QCCN	QCCN
Encapsulate equivalent code	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	LCC44,.65SQ	LCC44,.65SQ
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER	CHIP CARRIER, WINDOW	IN-LINE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	NOT SPECIFIED	225	225	NOT SPECIFIED	225	225	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V	3/5,5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	5.72 mm	4.57 mm	4.57 mm	5.72 mm	4.57 mm	4.57 mm	5.59 mm	2.74 mm	2.74 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.03 mA	0.04 mA	0.03 mA	0.04 mA	0.03 mA	0.03 mA	0.04 mA	0.03 mA	0.04 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	NO	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.65 mm	15.24 mm	16.65 mm	16.65 mm	15.24 mm	16.5862 mm	16.65 mm	15.24 mm	16.55 mm	16.55 mm
Base Number Matches	1	1	1	1	1	1	1	1	-	-

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