05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
250w UnbUmPed FliP ChiP tvs aRRay
desCRiPtion
The U0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level
transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed
specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These
devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per
line for an 8/20µs waveform. In addition, the U0402FCxxC series features superior clamping performance, low leak-
age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates
overshoot voltage due to package inductance.
U0402 PaCkage
FeatURes
•
•
•
•
•
•
•
•
•
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration and Monolithic Structure
Protection for 1 Line
RoHS Compliant
REACH Compliant
aPPliCations
•
•
•
•
•
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
meChaniCal ChaRaCteRistiCs
•
•
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•
Standard EIA Chip Size: 0402
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Plastic Tape per EIA Standard 481
Pin ConFigURation
05149.R6 2/11
Page 1
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05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
tyPiCal deviCe ChaRaCteRistiCs
maXimUm Ratings
@ 25°C Unless otherwise specified
PaRameteR
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
symbol
P
PP
T
A
T
STG
valUe
250
-55 to 150
-55 to 150
Units
Watts
°C
°C
eleCtRiCal ChaRaCteRistiCs PeR line
@ 25°C Unless otherwise specified
PaRt
nUmbeR
(note 1)
Rated
stand-oFF
voltage
v
wm
volts
U0402FC3.3C
U0402FC05C
U0402FC08C
U0402FC12C
U0402FC15C
U0402FC24C
U0402FC36C
notes
3.3
5.0
8.0
12.0
15.0
24.0
36.0
minimUm
bReakdown
voltage
@ 1ma
v
(bR)
volts
4.0
6.0
8.5
13.3
16.7
26.7
40.0
maXimUm
ClamPing
voltage
(Fig. 2)
@ i
P
= 1a
v
C
volts
7.0
9.8
13.4
19.0
24.0
43.0
64.0
maXimUm
ClamPing
voltage
(Fig. 2)
@ 8/20µs
v
C
@ i
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9A
35.7V @ 7A
55.0V @ 5A
84.0V @ 3A
maXimUm
leakage
CURRent
(note 2)
@v
wm
i
d
µa
75*
10**
10***
1
1
1
1
tyPiCal
CaPaCitanCe
@0v, 1mhz
C
pF
150
100
75
50
40
30
25
1. All devices are bidirectional. Electrical characteristics apply in both directions.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. ***Maximum leakage current < 200nA @ 5V.
05149.R6 2/11
Page 2
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05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
tyPiCal deviCe ChaRaCteRistiCs
FigURe 1
Peak PUlse PoweR vs PUlse time
10,000
P
PP
- Peak Pulse Power - watts
1,000
250W, 8/20µs Waveform
100
10
0.1
1
10
100
t
d
- Pulse duration - µs
1,000
10,000
120
i
PP
- Peak Pulse Current - % of i
PP
FigURe 2
PUlse wave FoRm
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
100
80
% of Rated Power
FigURe 3
PoweR deRating CURve
Peak Pulse Power
8/20µs
100
80
60
40
20
0
0
5
e
-t
60
40
20
0
Average Power
t
d
= t/(I
PP
/2)
10
15
t - time - µs
20
25
30
0
25
50
75 100 125
t
a
- ambient temperature - °C
150
05149.R6 2/11
Page 3
www.protekdevices.com
05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
tyPiCal deviCe ChaRaCteRistiCs
FigURe 4
oveRshoot & ClamPing voltage FoR U0402FC05C
35
25
5 volts per division
15
5
-5
esd test Pulse - 25 kilovolt, 1/30ns (waveshape)
FigURe 5
tyPiCal ClamPing voltage vs Peak PUlse CURRent U0402FC05C
12
v
C
- Clamping voltage - volts
8
4
0
0
5
10
i
PP
- Peak Pulse Current - amps
15
20
05149.R6 2/11
Page 4
www.protekdevices.com
05149
Only One Name Means ProTek’Tion™
U0402FC3.3C - U0402FC36C
soldeR ReFlow inFoRmation
PRinted CiRCUit boaRd ReCommendations
PaRameteR
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity (Only applies to bumped devices)
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP (Entek Cu Plus 106A)
±50µm
±20µm
60 seconds
270°C
valUe
ReqUiRements
Temperature:
T
P
for Lead-Free (Sn/Ag/Cu): 260-270°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
ReCommended non-soldeR mask
deFined Pad illUstRation
non-solder mask defined Pad
0.275mm dia.
solder mask opening
0.325mm dia.
solder stencil opening
0.330mm dia.
maximum solder Reflow
(35-53°C above maximum solder melt temp)
t
P
temperature - °C
Ramp-Up
solder melt
(maximum temp)
Ramp-down
Preheat
(stay below Flux activation temp)
30-60 seconds
Ramp-Up
15 seconds
(minimize)
Page 5
solder-time
15-20 seconds
Ramp-down
05149.R6 2/11
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