MX25L3205AMC-20G datasheet, PDF

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MX25L3205AMC-20G: Description32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY; Categorystorage storage; File Size962KB，46 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX25L3205AMC-20G Overview

32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY

MX25L3205AMC-20G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Macronix
Parts packaging code	SOIC
package instruction	0.300 INCH, ROHS COMPLIANT, MS-013, SOP-16
Contacts	16
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Is Samacsys	N
Maximum clock frequency (fCLK)	20 MHz
JESD-30 code	R-PDSO-G16
JESD-609 code	e3
length	10.3 mm
memory density	33554432 bi
Memory IC Type	FLASH
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of terminals	16
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL/SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Serial bus type	SPI
Maximum standby current	0.00001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	7.52 mm
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

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MX25L3205A

Macronix NBit

Memory Family

32M-BIT [x 1] CMOS SERIAL eLiteFlash

MEMORY

FEATURES

GENERAL

• Serial Peripheral Interface (SPI) compatible -- Mode 0

and Mode 3

• 33,554,432 x 1 bit structure

• 64 Equal Sectors with 64K byte each

- Any sector can be erased

• Single Power Supply Operation

- 2.7 to 3.6 volt for read, erase, and program operations

• Latch-up protected to 100mA from -1V to Vcc +1V

• Low Vcc write inhibit is from 1.5V to 2.5V

PERFORMANCE

• High Performance

- Fast access time: 50MHz serial clock (30pF + 1TTL

Load)

- Fast program time: 3ms/page (typical, 256-byte per

page)

- Fast erase time: 1s/sector (typical, 64K-byte per

sector) and 64s/chip (typical)

- Acceleration mode:

- Program time: 2.4ms/page (typical)

- Erase time: 0.8s/sector (typical) and 51s/chip

(typical)

• Low Power Consumption

- Low active read current: 30mA (max.) at 50MHz

- Low active programming current: 30mA (max.)

- Low active erase current: 38mA (max.)

- Low standby current: 50uA (max.)

- Deep power-down mode 1uA (typical)

• Minimum 10K erase/program cycle for array

• Minimum 100K erase/program cycle for additional 4Kb

SOFTWARE FEATURES

• Input Data Format

- 1-byte Command code

• Auto Erase and Auto Program Algorithm

Automatically erases and verifies data at selected

sector

Automatically programs and verifies data at selected

page by an internal algorithm that automatically times

the program pulse widths (Any page to be programed

should have page in the erased state first)

•

Status Register Feature

•

Electronic Identification

JEDEC 2-byte Device ID

- RES command, 1-byte Device ID

- REMS command, ADD=00H will output the

manufacturer's ID first and ADD=01H will output device

ID first

•

Additional 4Kb sector independent from main memory

for parameter storage to eliminate EEPROM from

system

HARDWARE FEATURES

•

SCLK Input

Serial clock input

• SI Input

Serial Data Input

• SO/PO7

- Serial Data Output or Parallel mode Data output/input

• WP#/ACC Pin

Hardware write protection and Program/erase accel-

eration

• HOLD# pin

pause the chip without disselecting the chip (not for

parallel mode, please connect HOLD# pin to VCC dur-

ing parallel mode)

• PO0~PO6

- for parallel mode data output/input

• PACKAGE

16-pin SOP (300mil)

- 8-land SON (8x6mm)

All Pb-free devices are RoHS Compliant

P/N: PM1243

REV. 1.2, NOV. 06, 2006

MX25L3205AMC-20G Related Products

	MX25L3205AMC-20G	MX25L3205A	MX25L3205AMI-20	MX25L3205AMC-20
Description	32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY	32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY	32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY	32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY
Is it Rohs certified?	conform to	-	incompatible	incompatible
Maker	Macronix	-	Macronix	Macronix
Parts packaging code	SOIC	-	SOIC	SOIC
package instruction	0.300 INCH, ROHS COMPLIANT, MS-013, SOP-16	-	SOP, SOP16,.4	0.300 INCH, MS-013, SOP-16
Contacts	16	-	16	16
Reach Compliance Code	unknow	-	unknow	unknow
ECCN code	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A
Maximum clock frequency (fCLK)	20 MHz	-	20 MHz	20 MHz
JESD-30 code	R-PDSO-G16	-	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e3	-	e0	e0
length	10.3 mm	-	10.3 mm	10.3 mm
memory density	33554432 bi	-	33554432 bi	33554432 bi
Memory IC Type	FLASH	-	FLASH	FLASH
memory width	1	-	1	1
Number of functions	1	-	1	1
Number of terminals	16	-	16	16
word count	33554432 words	-	33554432 words	33554432 words
character code	32000000	-	32000000	32000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	85 °C	70 °C
organize	32MX1	-	32MX1	32MX1
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	SOP	SOP
Encapsulate equivalent code	SOP16,.4	-	SOP16,.4	SOP16,.4
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL/SERIAL	-	PARALLEL/SERIAL	PARALLEL/SERIAL
Peak Reflow Temperature (Celsius)	260	-	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	-	3/3.3 V	3/3.3 V
Programming voltage	2.7 V	-	2.7 V	2.7 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	-	2.65 mm	2.65 mm
Serial bus type	SPI	-	SPI	SPI
Maximum standby current	0.00001 A	-	0.00001 A	0.00001 A
Maximum slew rate	0.03 mA	-	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V
surface mount	YES	-	YES	YES
technology	CMOS	-	CMOS	CMOS
Temperature level	COMMERCIAL	-	INDUSTRIAL	COMMERCIAL
Terminal surface	MATTE TIN	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm
Terminal location	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	40	-	NOT SPECIFIED	NOT SPECIFIED
type	NOR TYPE	-	NOR TYPE	NOR TYPE
width	7.52 mm	-	7.52 mm	7.52 mm
write protect	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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