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MX25L3205AMC-20

Description
32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY
Categorystorage    storage   
File Size962KB,46 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric Compare View All

MX25L3205AMC-20 Overview

32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY

MX25L3205AMC-20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeSOIC
package instruction0.300 INCH, MS-013, SOP-16
Contacts16
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Is SamacsysN
Maximum clock frequency (fCLK)20 MHz
JESD-30 codeR-PDSO-G16
JESD-609 codee0
length10.3 mm
memory density33554432 bi
Memory IC TypeFLASH
memory width1
Number of functions1
Number of terminals16
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX1
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL/SERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Serial bus typeSPI
Maximum standby current0.00001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width7.52 mm
write protectHARDWARE/SOFTWARE
Base Number Matches1
MX25L3205A
Macronix NBit
TM
Memory Family
32M-BIT [x 1] CMOS SERIAL eLiteFlash
TM
MEMORY
FEATURES
GENERAL
• Serial Peripheral Interface (SPI) compatible -- Mode 0
and Mode 3
• 33,554,432 x 1 bit structure
• 64 Equal Sectors with 64K byte each
- Any sector can be erased
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to Vcc +1V
• Low Vcc write inhibit is from 1.5V to 2.5V
PERFORMANCE
• High Performance
- Fast access time: 50MHz serial clock (30pF + 1TTL
Load)
- Fast program time: 3ms/page (typical, 256-byte per
page)
- Fast erase time: 1s/sector (typical, 64K-byte per
sector) and 64s/chip (typical)
- Acceleration mode:
- Program time: 2.4ms/page (typical)
- Erase time: 0.8s/sector (typical) and 51s/chip
(typical)
• Low Power Consumption
- Low active read current: 30mA (max.) at 50MHz
- Low active programming current: 30mA (max.)
- Low active erase current: 38mA (max.)
- Low standby current: 50uA (max.)
- Deep power-down mode 1uA (typical)
• Minimum 10K erase/program cycle for array
• Minimum 100K erase/program cycle for additional 4Kb
SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Auto Erase and Auto Program Algorithm
-
Automatically erases and verifies data at selected
sector
-
Automatically programs and verifies data at selected
page by an internal algorithm that automatically times
the program pulse widths (Any page to be programed
should have page in the erased state first)
Status Register Feature
Electronic Identification
-
JEDEC 2-byte Device ID
- RES command, 1-byte Device ID
- REMS command, ADD=00H will output the
manufacturer's ID first and ADD=01H will output device
ID first
Additional 4Kb sector independent from main memory
for parameter storage to eliminate EEPROM from
system
HARDWARE FEATURES
SCLK Input
-
Serial clock input
• SI Input
-
Serial Data Input
• SO/PO7
- Serial Data Output or Parallel mode Data output/input
• WP#/ACC Pin
-
Hardware write protection and Program/erase accel-
eration
• HOLD# pin
-
pause the chip without disselecting the chip (not for
parallel mode, please connect HOLD# pin to VCC dur-
ing parallel mode)
• PO0~PO6
- for parallel mode data output/input
• PACKAGE
-
16-pin SOP (300mil)
- 8-land SON (8x6mm)
-
All Pb-free devices are RoHS Compliant
P/N: PM1243
REV. 1.2, NOV. 06, 2006
1

MX25L3205AMC-20 Related Products

MX25L3205AMC-20 MX25L3205A MX25L3205AMI-20 MX25L3205AMC-20G
Description 32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY 32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY 32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY 32M-BIT [x 1] CMOS SERIAL eLiteFlashTM MEMORY
Is it Rohs certified? incompatible - incompatible conform to
Maker Macronix - Macronix Macronix
Parts packaging code SOIC - SOIC SOIC
package instruction 0.300 INCH, MS-013, SOP-16 - SOP, SOP16,.4 0.300 INCH, ROHS COMPLIANT, MS-013, SOP-16
Contacts 16 - 16 16
Reach Compliance Code unknow - unknow unknow
ECCN code 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A
Maximum clock frequency (fCLK) 20 MHz - 20 MHz 20 MHz
JESD-30 code R-PDSO-G16 - R-PDSO-G16 R-PDSO-G16
JESD-609 code e0 - e0 e3
length 10.3 mm - 10.3 mm 10.3 mm
memory density 33554432 bi - 33554432 bi 33554432 bi
Memory IC Type FLASH - FLASH FLASH
memory width 1 - 1 1
Number of functions 1 - 1 1
Number of terminals 16 - 16 16
word count 33554432 words - 33554432 words 33554432 words
character code 32000000 - 32000000 32000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C - 85 °C 70 °C
organize 32MX1 - 32MX1 32MX1
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - SOP SOP
Encapsulate equivalent code SOP16,.4 - SOP16,.4 SOP16,.4
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL/SERIAL - PARALLEL/SERIAL PARALLEL/SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED 260
power supply 3/3.3 V - 3/3.3 V 3/3.3 V
Programming voltage 2.7 V - 2.7 V 2.7 V
Certification status Not Qualified - Not Qualified Not Qualified
Maximum seat height 2.65 mm - 2.65 mm 2.65 mm
Serial bus type SPI - SPI SPI
Maximum standby current 0.00001 A - 0.00001 A 0.00001 A
Maximum slew rate 0.03 mA - 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V - 3 V 3 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level COMMERCIAL - INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) MATTE TIN
Terminal form GULL WING - GULL WING GULL WING
Terminal pitch 1.27 mm - 1.27 mm 1.27 mm
Terminal location DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED 40
type NOR TYPE - NOR TYPE NOR TYPE
width 7.52 mm - 7.52 mm 7.52 mm
write protect HARDWARE/SOFTWARE - HARDWARE/SOFTWARE HARDWARE/SOFTWARE

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