(for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
C02E10.pdf 04.1.20
Chip Monolithic
Ceramic Capacitors
Murata
Manufacturing Co., Ltd.
Cat.No.C02E-10
Please read rating and
!CAUTION
(for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDFcatalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore, there is no space for detailed specifications. Therefore, or to transact theour product specification orspecificaions approval sheet for product specification before ordering.
This catalog has only typical specifications because you are requested to approve our product specifications please approve approval sheet for product transact the before ordering.
C02E10.pdf 04.1.20
CONTENTS
Part Numbering
Selection Guide
1
2
3
4
for Flow/Reflow Soldering GRM15/18/21/31 Series
for Reflow Soldering GRM32/43/55 Series
Ultra-small GRM03 Series
Thin Type (Flow/Reflow)
2
6
7
15
18
20
22
27
32
37
39
42
48
51
56
61
69
79
81
85
91
97
104
109
113
117
121
122
123
GRM Series Specifications and Test Methods
5
6
Thin Layer Large-capacitance Type
Low-dissipation Type
GRM Series Data
7
8
9
10
11
12
13
Microchips
Capacitor Arrays
for Ultrasonic Sensors
Low ESL
High Frequency for Flow/Reflow Soldering
High-Q & High Power Type
High Frequency Type
ERF/ERH/ERA/ERD Series Data
Package
!
Caution
Notice
Reference Data
14
15
16
17
18
19
20
Medium-voltage Low Dissipation Factor
Medium-voltage High-Capacitance for General-Use
Only for Information Devices/Tip & Ring
AC250V(r.m.s.) Type
Safety Standard Recognized Type GC (UL, IEC60384-14 Class X1/Y2)
Safety Standard Recognized Type GD (IEC60384-14 Class Y3)
Safety Standard Recognized Type GF (IEC60384-14 Class Y2)
Please read rating and
!CAUTION
(for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDFcatalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore, there is no space for detailed specifications. Therefore, or to transact theour product specification orspecificaions approval sheet for product specification before ordering.
This catalog has only typical specifications because you are requested to approve our product specifications please approve approval sheet for product transact the before ordering.
C02E10.pdf 04.1.20
1
2
21
Safety Standard Recognized Type GB (IEC60384-14 Class X2)
124
125
129
132
135
141
145
GA3 Series Specifications and Test Methods
GRM/GR4/GA2/GA3 Series Data
Package
!
Caution
Notice
ISO 9000 Certifications
3
4
5
6
7
Please refer to "Specifications and Test Methods" at the end of each chapter of
5
–
17
.
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Recycled Paper
Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore,thereareno space for detailed specifications. Therefore, please approve our productsheet for product specificaions approval sheet for product specifications before ordering.
This catalog has only typical specifications because you is requested to approve our product specifications or to transact the approval specifications or transact the before ordering.
C02E10.pdf 04.1.20
o
Part Numbering
Chip Monolithic Ceramic Capacitors
(Part Number)
qProduct
ID
wSeries
Product ID
GR
Code
M
4
F
H
A
D
GQ
GM
GN
LL
GJ
M
A
M
L
M
6
GA
GC
2
3
P
M
Series
Tin Plated Layer
Only for Information Devices / Tip & Ring
High Frequency and
high Power Type
High Frequency and High Power Type
(Ribbon Terminal)
High Frequency Type
High Frequency Type
(Ribbon Terminal)
High Frequency for
Flow/Reflow Soldering
Monolithic Microchip
Capacitor Array
Low ESL Wide Width Type
High Frequency Low Loss Type
Tin Plated Type
High Frequency Low Loss Type
for AC250V (r.m.s.)
Safety Standard Recognized Type
Automotive Soldering Electrode
Automotive Tin Plated Layer
GR
q
M
w
18
e
8
B1 1H
y
102
u
K
i
A01 K
o
!0
rDimension
(T)
Code
2
3
4
5
6
7
8
9
A
B
C
D
E
F
M
N
R
S
Q
X
Dimension (T)
2-elements (Array Type)
0.3 mm
4-elements (Array Type)
0.5 mm
0.6 mm
0.7 mm
0.8 mm
0.85 mm
1.0 mm
1.25 mm
1.6 mm
2.0 mm
2.5 mm
3.2 mm
1.15 mm
1.35 mm
1.8 mm
2.8 mm
1.5 mm
Depends on individual standards.
r t
ER
With the array type GNM series, "Dimension(T)" indicates the number of
elements.
eDimension
(LgW)
Code
03
05
08
11
15
18
1D
1X
21
22
31
32
3X
42
43
52
55
Dimension (LgW)
0.6g0.3 mm
0.5g0.5 mm
0.8g0.8 mm
1.25g1.0 mm
1.0g0.5 mm
1.6g0.8 mm
1.4g1.4 mm
Depends on individual standards.
2.0g1.25 mm
2.8g2.8 mm
3.2g1.6 mm
3.2g2.5 mm
4.5g2.0 mm
4.5g3.2 mm
5.7g2.8 mm
5.7g5.0 mm
0805
1111
1206
1210
1808
1812
2211
2220
Continued on the following page.
EIA
0201
0202
0303
0504
0402
0603
Depends on individual standards.
2
Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore,thereareno space for detailed specifications. Therefore, please approve our productsheet for product specificaions approval sheet for product specifications before ordering.
This catalog has only typical specifications because you is requested to approve our product specifications or to transact the approval specifications or transact the before ordering.
FPGA and PCB collaborative design solution: We know that after the FPGA function development is completed, the corresponding functional circuit board must be developed. In PCB design, a lot of repetit...
Dear friends, I urgently need to use DOS commands to control COM input and output. I hope you can help me. The specific situation is as follows: For testing, I want to add the control information of t...
I read some information online and learned that the power supply generally needs a decoupling capacitor to the ground. Is there any problem with adding the decoupling capacitor in the schematic diagra...
This circuit is a co sensor application circuit.
1. Why is this load resistor needed? Can it be removed and current conversion be performed directly?2. Where does the current on the counting electrode...
There is an error in the microcontroller C program. Please help me. The following error occurs when compiling with Keil C51:
Building target 'target1' Compiling Text1.c... TEXT1.C(212): error C141: sy...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
Current Development Status of DVR Market
A DVR, or digital video recorder, uses a hard disk for recording, unlike traditional analog video recorders. It's often called a DVR because it's a com...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
Pure electric vehicles, structurally speaking, have components such as a power battery. In addition to the power battery, a small battery also powers some low-voltage electrical components and even...[Details]
With the advent of the electric car era, the number of pure electric vehicles has increased significantly, but many car owners do not know how to properly maintain pure electric vehicles. In additi...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
1. Fault phenomenon and cause analysis
1. During the operation of the equipment, the expansion sleeve is subjected to a large torque, and the mating surfaces of the shaft and the sleeve move...[Details]
In the field of communications power supplies, AC/DC rectifier power supplies are called primary power supplies or basic power supplies, while DC/DC converters are called secondary power supplies. ...[Details]
With the gradual popularization of new energy vehicles in recent years, more and more people have been able to access and purchase electric vehicles. The structure of electric vehicles is composed ...[Details]
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
