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TSS933EAS883

Description
Framer, BICMOS, PQCC28, MQFP-28
CategoryWireless rf/communication    Telecom circuit   
File Size142KB,21 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric View All

TSS933EAS883 Overview

Framer, BICMOS, PQCC28, MQFP-28

TSS933EAS883 Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionQCCJ,
Contacts28
Reach Compliance Codeunknown
JESD-30 codeS-PQCC-J28
length11.5062 mm
Number of functions1
Number of terminals28
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height4.57 mm
Nominal supply voltage5 V
surface mountYES
technologyBICMOS
Telecom integrated circuit typesFRAMER
Temperature levelMILITARY
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width11.5062 mm
Base Number Matches1
TSS923(E)/933(E)
HSDLink Transmitter/Receiver
1. Introduction
The TSS923 Transmitter and TSS933 Receiver are point
to point communications building blocks that transfer
data over high speed serial links at 160 up to 400
Mbauds/s (depending on the data encoder/decoder
selection).
Eight bits of user data or protocol information are loaded
into the Transmitter and are encoded within the 8B10B or
8B16B mode and then serialized. Serial data is shifted out
of the three differential positive ECL (PECL) serial ports
at the bit rate. The bit rate is 10 times or 16 times the byte
rate (depends on the encoded mode). The Receiver
accepts the serial bit stream at its differential line inputs
and, using an on chip PLL, recovers the serial bit rate
information for a correct data retiming. The bit stream is
deserialized, decoded within the 8B10B or 8B16B mode
and checked for transmission errors. Recovered bytes are
presented in parallel to the receiving host along with a
byte rate clock. The 8B/10B or 8B/16B encoder/decoder
can be disabled in systems that already encode or
scramble the transmitted data. HSDLink chipset are ideal
for a variety of applications where a parallel interface can
be replaced with a high speed point to point serial link.
Applications include,
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Interconnecting workstations
Servers
Mass storage
Video transmission equipment.
2. Features
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Fibre Channel compliant
IBM ESCON
1
compliant
ATM compliant
HOTLink
2
package and pinout compatible
Case Temperature range: -55 ºC up to 125 ºC
190 up to 400 Mbaud/s link data rate
TTL synchronous I/O
8B/10B encoded mode
3
8B/16B Hamming encoded mode
160 up to 400 Mbaud/s link data rate (8B/16B)
160 up to 330 Mbaud/s link data rate (8B/10B)
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Hardened design for SEU tolerance (8B/16B)
Bypass mode
Built In Self Test
Dose Rate > 30 krad
Triple PECL 100K serial outputs
Dual PECL 100K serial inputs
On-chip Phase Locked Loop
Single +5V power supply
28-pin MQFPJ/LCC
(*)
/SOIC
(*)
/PLCC
(*)
0.8
µ
m BiCMOS (Radiation Tolerant for “E”
versions)
1. ESCON is a registered trademark of IBM
2. HOTLink is a trademark of Cypress Semiconductor Corporation
3. US Patent 4,488,739 “8B/10B Partitioned Block Transmission Code” Dec 4,1984
(*) Preview
MATRA MHS
Rev. E (27 Mar.97)
1
Preliminary Information

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