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GD4011BC

Description
NAND GATE,
Categorylogic    logic   
File Size117KB,2 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

GD4011BC Overview

NAND GATE,

GD4011BC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP14,.3
Reach Compliance Codecompliant
JESD-30 codeR-PDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Certification statusNot Qualified
Schmitt triggerNO
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

GD4011BC Related Products

GD4011BC GD4011BDC GD4012BDC GD4012BC
Description NAND GATE, NAND GATE, NAND GATE, NAND GATE,
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 SOP, SOP14,.25 SOP, SOP14,.25 DIP, DIP14,.3
Reach Compliance Code compliant compliant compliant compliant
JESD-30 code R-PDIP-T14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP
Encapsulate equivalent code DIP14,.3 SOP14,.25 SOP14,.25 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
surface mount NO YES YES NO
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1
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