GD4011BDC datasheet, PDF - EEWORLD Datasheet

GD4011BDC: DescriptionNAND GATE,; Categorylogic logic; File Size117KB，2 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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GD4011BDC Overview

NAND GATE,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
package instruction	SOP, SOP14,.25
Reach Compliance Code	compliant
JESD-30 code	R-PDSO-G14
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	5/15 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

	GD4011BDC	GD4012BDC	GD4012BC	GD4011BC
Description	NAND GATE,	NAND GATE,	NAND GATE,	NAND GATE,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	SOP, SOP14,.25	SOP, SOP14,.25	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	compliant	compliant	compliant	compliant
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of terminals	14	14	14	14
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	DIP
Encapsulate equivalent code	SOP14,.25	SOP14,.25	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1

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