SMJ320C6701GLPS16 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> SMJ320C6701GLPS16

SMJ320C6701GLPS16: Description32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，66 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SMJ320C6701GLPS16 Overview

32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429

SMJ320C6701GLPS16 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	BGA,
Contacts	429
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Other features	-40 TO 90 OPERATING CASE TEMPERATURE
Address bus width	22
barrel shifter	NO
boundary scan	YES
maximum clock frequency	166.66 MHz
External data bus width	32
Format	FLOATING POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-CBGA-B429
length	27 mm
low power mode	YES
Number of terminals	429
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Filter level	MIL-PRF-38535
Maximum seat height	3.3 mm
Maximum supply voltage	1.99 V
Minimum supply voltage	1.81 V
Nominal supply voltage	1.9 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

SMJ320C6701GLPS16 Related Products

	SMJ320C6701GLPS16	SMJ320C6701GLPS14	SMJ320C6701GLPW16	SM320C6701GLPS14	SM320C6701GJC16EP	SM320C6701GJC12EP	SM320C6701GJCA16EP	SM320C6701GLPW16
Description	32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429	32-BIT, 140.84MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429	32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429	32-BIT, 140MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429	32-BIT, 166.67MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352	32-BIT, 120.48MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352	32-BIT, 166.67MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352	IC 32-BIT, 167 MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429, Digital Signal Processor
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	429	429	429	429	352	352	352	429
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Address bus width	22	22	-	-	22	22	22	22
barrel shifter	NO	NO	-	-	NO	NO	NO	NO
boundary scan	YES	YES	-	-	YES	YES	YES	YES
maximum clock frequency	166.66 MHz	140.84 MHz	-	-	166.67 MHz	120.48 MHz	166.67 MHz	167 MHz
External data bus width	32	32	-	-	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	-	-	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	MULTIPLE	MULTIPLE	-	-	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-CBGA-B429	S-CBGA-B429	-	-	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-CBGA-B429
length	27 mm	27 mm	-	-	35 mm	35 mm	35 mm	27 mm
low power mode	YES	YES	-	-	YES	YES	YES	YES
Number of terminals	429	429	-	-	352	352	352	429
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	BGA	-	-	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	-	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	-	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.3 mm	3.3 mm	-	-	3.5 mm	3.5 mm	3.5 mm	3.3 mm
Maximum supply voltage	1.99 V	1.99 V	-	-	1.99 V	1.89 V	1.99 V	1.99 V
Minimum supply voltage	1.81 V	1.81 V	-	-	1.81 V	1.71 V	1.81 V	1.81 V
Nominal supply voltage	1.9 V	1.9 V	-	-	1.9 V	1.8 V	1.9 V	1.9 V
surface mount	YES	YES	-	-	YES	YES	YES	YES
technology	CMOS	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	-	-	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	-	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	-	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	27 mm	27 mm	-	-	35 mm	35 mm	35 mm	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	-	-	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Maker	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments

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