SM320C6701GLPS14 datasheet, PDF

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SM320C6701GLPS14: Description32-BIT, 140MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，66 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SM320C6701GLPS14 Overview

32-BIT, 140MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429

SM320C6701GLPS14 Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	BGA,
Contacts	429
Reach Compliance Code	unknown
ECCN code	3A001.A.3

SM320C6701GLPS14 Related Products

	SM320C6701GLPS14	SMJ320C6701GLPS14	SMJ320C6701GLPS16	SMJ320C6701GLPW16	SM320C6701GJC16EP	SM320C6701GJC12EP	SM320C6701GJCA16EP	SM320C6701GLPW16
Description	32-BIT, 140MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429	32-BIT, 140.84MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429	32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429	32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429	32-BIT, 166.67MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352	32-BIT, 120.48MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352	32-BIT, 166.67MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352	IC 32-BIT, 167 MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429, Digital Signal Processor
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	429	429	429	429	352	352	352	429
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.3	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Address bus width	-	22	22	-	22	22	22	22
barrel shifter	-	NO	NO	-	NO	NO	NO	NO
boundary scan	-	YES	YES	-	YES	YES	YES	YES
maximum clock frequency	-	140.84 MHz	166.66 MHz	-	166.67 MHz	120.48 MHz	166.67 MHz	167 MHz
External data bus width	-	32	32	-	32	32	32	32
Format	-	FLOATING POINT	FLOATING POINT	-	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	-	MULTIPLE	MULTIPLE	-	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	-	S-CBGA-B429	S-CBGA-B429	-	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-CBGA-B429
length	-	27 mm	27 mm	-	35 mm	35 mm	35 mm	27 mm
low power mode	-	YES	YES	-	YES	YES	YES	YES
Number of terminals	-	429	429	-	352	352	352	429
Package body material	-	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	-	BGA	BGA	-	BGA	BGA	BGA	BGA
Package shape	-	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	3.3 mm	3.3 mm	-	3.5 mm	3.5 mm	3.5 mm	3.3 mm
Maximum supply voltage	-	1.99 V	1.99 V	-	1.99 V	1.89 V	1.99 V	1.99 V
Minimum supply voltage	-	1.81 V	1.81 V	-	1.81 V	1.71 V	1.81 V	1.81 V
Nominal supply voltage	-	1.9 V	1.9 V	-	1.9 V	1.8 V	1.9 V	1.9 V
surface mount	-	YES	YES	-	YES	YES	YES	YES
technology	-	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Terminal form	-	BALL	BALL	-	BALL	BALL	BALL	BALL
Terminal pitch	-	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	-	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	-	27 mm	27 mm	-	35 mm	35 mm	35 mm	27 mm
uPs/uCs/peripheral integrated circuit type	-	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	-	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER

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