The GbX Backplane Interconnect System Delivers Speeds Beyond 6.0Gbps and
High Density With Up To 69 Mated Differential Channels Per Inch
The GbX connector system provides the speed, density, and low applied cost required by leading-edge
backplane applications. It is especially suited for designs that require future speed upgrades by
daughtercard replacement into an existing backplane. With a native differential signaling speed of
6.0Gbps, the system is well suited for existing and future generations of XAUI (10 Gigabit Attachment Unit
Interface) and InfiniBand* based systems, in addition to those based on ATCA** (Advanced Telecom
Computing Architecture) and OIF (Optical Internetworking Forum) chip protocols.
Internetworking and telecommunication equipment engineers will benefit by the GbX connector’s ability to
provide not only a high-density, low applied-cost solution in the near term, but also by its electrical
performance in upgradeable systems. Speeds of 10.0Gbps and beyond have been demonstrated with
appropriate SERDES (Serializer / Deserializer) devices and board-material selection. This allows system
architects freedom-of-design for faster future systems without the worry of backwards compatibility, along
with the economy of a common backplane for two generations of equipment.
In addition, the GbX L-Series system provides a complimentary high-density open pin field for cost-
effective design of slower speed circuits along the same stiffener as the standard, high-speed GbX wafers.
Features and Benefits
■
Up to 69 real differential pairs per linear inch
(27 real differential pairs per 10mm) provide
higher density than VHDM-HSD
®
■
Bifurcated contact beams in daughtercard
receptacle allow greater reliability with two
points of contact to header pin
■
Modular daughtercard components with GbX
L-Series available as custom, cost-effective
receptacle assemblies
1.85 by 1.85mm
(.073 by .073") Pitch
GbX
®
Module-to-Backplane
Connector System
In 4- and 5-Pair Columns
75220, 75360 Daughtercard
Assemblies
75235, 75237 Backplane
Signal Headers
75341, 75510 Backplane
Power
■
■
Optimized differential pair contacts allow
easier board trace routing
Data rate options up to 10.0Gbps to support
future daughtercard speed upgrades
SPECIFICATIONS
Reference Information
Packaging:
Daughtercard Assemblies – Tube
Headers -- Tray
UL File No.: Pending
CSA File No.: Pending
Designed In: mm
Electrical
Signal/Shield Contact Current Rating: 1.0A
Contact to Plated-Through-Hole Resistance: 1.0 milliohm
max.
Power Blade Contact Resistance: 3.0 milliohms max.
Dielectric Withstanding Voltage: 750V RMS
Insulation Resistance: 10,000 Megohms min.
Mechanical
Contact Insertion Force: 44.48N (10.00 lb) typical per
contact
Contact Retention Force: 8.90N (2.00 lb) min. per
contact
Mating Force: 0.59N (0.13 lb) max. per contact
Unmating Force: 0.29N (0.07 lb) min. per contact
Durability: 250 cycles max.
Physical
Housing: Liquid Crystal Polymer, UL 94V-0
Contact: Copper Alloy
Plating:
Contact Area – 0.76um (30µ”) Gold (Au) min.
Solder Tail Area – Tin (Sn)
Underplating – Nickel (Ni)
PCB Thickness: 1.60mm (.062”) typical
Operating Temperature: -55 to 105 degrees C
Notes:
GbX and VHDM-HSD are registered trademarks of Teradyne, Inc.
*InfiniBand is a registered trademark of the InfiniBand Trade Association
**ATCA is a trademark of the PCI Industrial Manufacturers Group
APPLICATIONS
■
■
■
■
Internetworking Equipment:
- Servers, Hubs, and Routers
Telecommunications Equipment:
- Central Office, Cellular Infrastructure and
Multi-platform Service (DSL, Cable Data) systems
Medical Diagnostic Equipment
Test and Measurement Equipment
1.85 by 1.85mm
(.073 by .073") Pitch
GbX
®
Module-to-Backplane
Connector System
In 4- and 5-Pair Columns
75220, 75360 Daughtercard
Assemblies
75235, 75237 Backplane
Signal Headers
75341, 75510 Backplane
Power
ORDERING INFORMATION
Daughtercard Assembly
Signal wafers, power modules and guide modules
sequentially assigned by application
Backplane Signal Header
10-Column Open
25-Column Open
10-Column Guide Left
25-Column Guide Left
10-Column Guide Right
25-Column Guide Right
Backplane Power and Guide
Components
Power
Stand-Alone Guide Pin
4-Pair
75220-XXXX
(Wafer 75221-0001 for reference information only)
5-Pair
75360-XXXX
(Wafer 75361-0001 for reference information only)
5-Pair (10 Circuits per Column)*
Order No.
Circuits
75237-0104
100
75237-0204
250
75237-2104
100
75237-2204
250
75237-4104
100
75237-4204
250
5-Pair
Circuits
8
75234-0469
Order No.
75510-4444
75234-0469
Circuits
10
4-Pair (8 Circuits per Column)*
Order No.
Circuits
75235-0104
80
75235-0204
200
75235-2104
80
75235-2204
200
75235-4104
80
75235-4204
200
4-Pair
Order No.
75341-4444
*Note: Multiple keying options available. Contact Molex for details.
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
amerinfo@molex.com
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
feninfo@molex.com
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
fesinfo@molex.com
European Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
Fax:630-969-1352
Visit our Web site at www.mo lex .com/product/ backplan /g bx .h tml
Order No. USA-250
Printed in USA/2.5K/JI/JI/2004.07
©
2004, Molex
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