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BGA735L16E6327XTSA1

Description
RF Front End Circuit, 2.30 X 2.30 MM, 0.39 MM HEIGHT, ROHS COMPLIANT, TSLP-16
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,39 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric View All

BGA735L16E6327XTSA1 Overview

RF Front End Circuit, 2.30 X 2.30 MM, 0.39 MM HEIGHT, ROHS COMPLIANT, TSLP-16

BGA735L16E6327XTSA1 Parametric

Parameter NameAttribute value
package instructionHVQCCN,
Reach Compliance Codecompliant
JESD-30 codeS-XQCC-N16
length2.3 mm
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-30 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Maximum seat height0.4 mm
Nominal supply voltage2.8 V
surface mountYES
Telecom integrated circuit typesRF FRONT END CIRCUIT
Temperature levelOTHER
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
width2.3 mm
Base Number Matches1
Data Sheet, V3.1, January 2009
BGA735L16
High Linearity Tri-Band UMTS LNA
( 2 1 0 0 , 1 9 0 0 / 1 8 0 0 /2 1 0 0 , 8 0 0 / 9 0 0 M H z )
RF & Protection Devices

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