EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

TMS416800-60DE

Description
2MX8 FAST PAGE DRAM, 60ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32
Categorystorage    storage   
File Size353KB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

TMS416800-60DE Overview

2MX8 FAST PAGE DRAM, 60ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32

TMS416800-60DE Parametric

Parameter NameAttribute value
Parts packaging codeTSOP
package instructionTSOP2,
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFAST PAGE
Maximum access time60 ns
Other featuresRAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 codeR-PDSO-G32
length20.95 mm
memory density16777216 bi
Memory IC TypeFAST PAGE DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals32
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width10.16 mm
Base Number Matches1

TMS416800-60DE Related Products

TMS416800-60DE TMS416800-70DE TMS416800P-80DE TMS416800P-70DE TMS416800P-70DZ TMS416800P-60DZ TMS416800-80DE TMS416800P-60DE TMS416800P-80DZ
Description 2MX8 FAST PAGE DRAM, 60ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32 IC 2M X 8 FAST PAGE DRAM, 70 ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32, Dynamic RAM 2MX8 FAST PAGE DRAM, 80ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32 2MX8 FAST PAGE DRAM, 70ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32 2MX8 FAST PAGE DRAM, 70ns, PDSO28 2MX8 FAST PAGE DRAM, 60ns, PDSO28 2MX8 FAST PAGE DRAM, 80ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32 2MX8 FAST PAGE DRAM, 60ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32 2MX8 FAST PAGE DRAM, 80ns, PDSO28
Reach Compliance Code unknow unknow unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 60 ns 70 ns 80 ns 70 ns 70 ns 60 ns 80 ns 60 ns 80 ns
Other features RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-J28 R-PDSO-J28 R-PDSO-G32 R-PDSO-G32 R-PDSO-J28
length 20.95 mm 20.95 mm 20.95 mm 20.95 mm 18.415 mm 18.415 mm 20.95 mm 20.95 mm 18.415 mm
memory density 16777216 bi 16777216 bi 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 28 28 32 32 28
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2 TSOP2 SOJ SOJ TSOP2 TSOP2 SOJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096 4096 4096 4096 4096 4096
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 3.76 mm 3.76 mm 1.2 mm 1.2 mm 3.76 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING J BEND J BEND GULL WING GULL WING J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
Parts packaging code TSOP TSOP TSOP TSOP - - TSOP TSOP -
package instruction TSOP2, TSOP2, TSOP2, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32 - SOJ, TSOP2, TSOP2, SOJ,
Contacts 32 32 32 32 - - 32 32 -
self refresh - - YES YES YES YES - YES YES
Maker - - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
What does STM32 do after startup?
In the MDK environment, what is done from power-on startup to MAIN()?Looking at the disassembly, it seems that there is some initialization of RAM, setting of stack, and interrupt vector.Can you pleas...
allensun006 stm32/stm8
Introduction to the method of board-level online compilation and downloading of C6000 DSP code
Traditional C6000 DSP software is compiled and debugged on a WINDOWS PC through CCS, and the compiled executable file is burned into FLASH after testing. By setting the DSP startup mode to start from ...
Aguilera Wireless Connectivity
Error 8 in "MCU Engineer Training"
...
qinkaiabc Microcontroller MCU
EEWORLD University Hall----Live Replay: TI Embedded Processor Latest Product Launch Conference
Live replay: TI embedded processor latest product launch : https://training.eeworld.com.cn/course/4497Texas Instruments (TI) will hold a new product launch event in Beijing on Monday, April 16. Paul N...
hi5 Integrated technical exchanges
Zichao Technology Co., Ltd.
Our company is an agent with strong support from Shanghai Ruyun Corporation. We sell various high-performance ICs such as charging management, reset circuit, high-power LED driver, DC/DC and AC/DC to ...
rml117 DSP and ARM Processors

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 812  242  190  299  257  17  5  4  7  6 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号