Shift Register, 64-Bit, CMOS, CDIP14,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Humidity sensitivity level | 2A |
| Number of digits | 64 |
| Number of functions | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 4731BDCQR | 4731BDC | 4731BDCQM | 4731BDM | 4731BDMQB | 4731BXDC | 4731BXDCQM | 4731BXDCQR | 4731BXDM | 4731BXDMQB | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, | Shift Register, 64-Bit, CMOS, CDIP14, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| Number of digits | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |