B1S thru B10S
MINI SURFACE MOUNT GLASS PASSIVATED RECTIFIERS
VOLTAGE - 100 TO 1000 VOLTS
CURRENT - 0.5 AMPERES
FEATURES
Plastic material used carries Underwiters
Laboratory recognition 94V-0
Low leakage
Surge overload rating-30 amperes peak
Ldeal for printed circuit board
Exceeds environmental standards of MMIL-S-19500
MECHANICAL DATA
Case Reliable low cost construction utilizing molded
plastic technique results in inexpensive product
Terminals Lead solderable per MIL-STD-202, Method 208
Polarity Polarity symbols molded or marking on body.
Mounting position Any
Weight 0.008 ounce, 0.22gram
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temp. unless otherwise specified
Single phase, half sine wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
B1S
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward on glass-epoxy P
.C.B (Note 1)
0
Current T
A
=30 C on aluminum substrate (Note 3)
Peak Forward Surge Current, 8.3ms Single Half Sine-Wave
Superimposed on Rated Load
I
2
t Rating fusing (t<8.35ms)
Maximum Forward Voltage Drop per Bridge Element at 0.5A
Maximum Reverse Current at Rated T
J
=25 C
0
DC Blocking Voltage per element T
J
=125 C
Typical Junction capacitance per leg (Note 1) C
J
Typical Thermal resistance per leg (Note 2) R
Operating Temperature Range T
J
Storage Temperature Range T
A
JA
0
B2S
200
140
200
B4S
400
280
400
0.5
0.8
30
5
1
5
25
85
B6S
600
420
600
B8S
800
560
800
B10S
1000
700
1000
UNITS
Volts
Volts
Volts
Amps
100
70
100
Amps
A
2
t
V
A
pF
0
C/W
0
-55 to +150
-55 to +150
C
C
0
NOTES
1. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 Volts
2. Thermal Resestance From Junction to Ambient and from junction to lead mounted on P
.C.B with 0.05 x 0.05 (13x13mm) copper pads.
3. On alum substrate P
.C.B with an rea of 0.8x0.8x0.25 (20x20x6.4mm) mounte on 0.05x0.05 (13x13mm) solder pad.
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1
B1S thru B10S
MINI SURFACE MOUNT GLASS PASSIVATED RECTIFIERS
RATING AND CHARACTERISTICS CURVES B1S THRU B10S
Fig. 1 - FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT
AMPERES
PEAK RFORWARD SURGE CURRENT,
AMPERES
1.0
0.8
0.6
0.4
MOUNTED ON PC BOARD
40
Fig. 2 - MAXIMUM NON-REPETITIVE
SURGE CURRENT
30
20
0.2
0.1
SINGLE PHASE HALF WAVE 60Hz
RESISTIVE OR INDUCTIVE LOAD
10
Pulse Width 8.3ms
Single Half-Sine-Wave
(JEDEC METHOD)
0
1
2
5
10
20
50
100
20
40
60
100
120
140
160
AMBIENT TEMPERATURE,
o
C
NUMBER OF CYCLES AT 60Hz
Fig. 5 - TYPICAL REVERSE CHARACTERISTICS
100
10
Fig. 4 - TYPICAL FORWARD CHARACTERISTICS
INSTANTANEOUS REVERSE CURRENT, (mA)
T
J
=125 C
o
10
INSTANTANEOUS FORWARD CURRENT, (A)
1.0
1.0
0.1
T
J
=25 C
o
0.1
0.01
0
0.01
0
20
40
60
80
100
120
140
0.2
0.4
0.6
0.8
1.0
T
J
=25
o
C
PULSE WIDTH:300
S
1.2
1.4
1.6
1.8
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)
Fig. 3 - TYPICAL JUNCTION CAPACITANCE
100
CAPACITANCE, (pF)
10
T
J
=25
o
C, f=1MHz
1.0
1
4
10.0
100
REVERSE VOLTAGE, VOLTS
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Embedded System
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