Fixed Gain 3.2 W Mono Class-D with Integrated DAC Noise Filter 9-DSBGA -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA9,3X3,16 |
| Contacts | 9 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Nominal bandwidth | 20 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | S-XBGA-B9 |
| JESD-609 code | e1 |
| length | 1.505 mm |
| Humidity sensitivity level | 1 |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 9 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 3.24 W |
| Package body material | UNSPECIFIED |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA9,3X3,16 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.625 mm |
| Maximum slew rate | 2.5 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.4 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.505 mm |
| Base Number Matches | 1 |
| TPA2037D1YFFT | TPA2037D1YFFR | |
|---|---|---|
| Description | Fixed Gain 3.2 W Mono Class-D with Integrated DAC Noise Filter 9-DSBGA -40 to 85 | Fixed Gain 3.2 W Mono Class-D with Integrated DAC Noise Filter 9-DSBGA -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Parts packaging code | BGA | BGA |
| package instruction | VFBGA, BGA9,3X3,16 | VFBGA, BGA9,3X3,16 |
| Contacts | 9 | 9 |
| Reach Compliance Code | compli | compli |
| ECCN code | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 6 weeks |
| Nominal bandwidth | 20 kHz | 20 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | S-XBGA-B9 | S-XBGA-B9 |
| JESD-609 code | e1 | e1 |
| length | 1.505 mm | 1.505 mm |
| Humidity sensitivity level | 1 | 1 |
| Number of channels | 1 | 1 |
| Number of functions | 1 | 1 |
| Number of terminals | 9 | 9 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Nominal output power | 3.24 W | 3.24 W |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | VFBGA | VFBGA |
| Encapsulate equivalent code | BGA9,3X3,16 | BGA9,3X3,16 |
| Package shape | SQUARE | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| power supply | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 0.625 mm | 0.625 mm |
| Maximum slew rate | 2.5 mA | 2.5 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V | 2.5 V |
| surface mount | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL | BALL |
| Terminal pitch | 0.4 mm | 0.4 mm |
| Terminal location | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 1.505 mm | 1.505 mm |
| Base Number Matches | 1 | 1 |
| Part Number | Manufacturer | Description |
|---|---|---|
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