REVISION F
DO NOT
SCALE FROM
THIS PRINT
PIN N
C
"D"
"C" REF
0.80 .031 TYP
02
LSEM-1XX-XX.X-X-DV-A-X-XX-TR
No OF POSITIONS
20,30,40,50
LEAD STYLE
* -02.5
-03.0
-04.0
-06.0
PLATING SPECIFICATION
F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
PACKAGING(SEE NOTE 6)
-TR: TAPE & REEL
OPTION
-K: POLYIMIDE FILM
(USE K-500-300,SEE FIG 3, SHT 3)
*-WT: WELD TAB
(USE WT-36-XX-T, SEE FIG 4, SHT 3)
(NOT AVAILABLE WITH *-S)
SHIELD
* -S: WITH SHIELD
(NOT AVAILABLE WITH *-WT)
-N: NO SHIELD
-A: ALIGNMENT PIN
01
SEE NOTE 4
"A"
TAIL OPTION
DV: DUAL VERTICAL
* = NOT TOOLED
C
0.670±0.10 .0264±.004
0.87±0.10 .034±.004
C
"A"
0.10[.004]
C
C
"B"
"A"
"E" REF
1.32 .052 REF
0.85 .033 REF
SECTION "A"-"A"
SCALE 5 : 1
1.32 .052 REF
0.95 .037 REF
(No OF POSITION X .80[.031])-.80[.031]
1.10 .043 REF
FIG 1
NOTES:
C
(LSEM-1XX-XX.X-X-DV-A-N-XX SHOWN)
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN
MILLIMETERS[INCHES].
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
1.
REPRESENTS A CRITICAL DIMENSION.
2. BURR ALLOWANCE: .038 [.0015].
3. MINIMUM PUSHOUT FORCE; TERMINALS: 2.22 N [.5 LBS], CONTACTS: 2.22 N [.5 LBS].
4. WHEN MATING WITH ANOTHER LSEM-DV, 01 WILL MATE WITH CONTACT 02 ON MATING CONNECTOR.
WHEN MATING WITH A LSEM-DH, PIN 01 WILL MATE WITH PIN N, WHERE N = TOTAL NUMBER OF POSITIONS.
5. MEASURE FROM TOP OF VERTICAL WALL.
6. FOR QUANTITIES UP TO 49 PCS., NO LEADER , TRAILER OR REEL WILL BE SUPPLIED.
FOR QUANTITIES OF 50-124 PCS., NO LEADER OR TRAILER WILL BE SUPPLIED.
F:\DWG\MISC\MKTG\LSEM-1XX-XX.X-X-DV-A-X-XX-TR-MKT.SLDDRW
X.X: 0.3 [.01]
2
X.XX: 0.13 [.005]
X.XXX: 0.051 [.0020]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
INSULATOR: BLACK LCP, UL 94 VO
CONTACT OR TERMINAL: PHOS BRONZE
SHIELD: STAINLESS STEEL
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
0.8mm PITCH TERMINAL/SOCKET COMBO
LSEM-1XX-XX.X-X-DV-A-X-XX-TR
04/01/2009
SHEET
1
OF
3
BY:
CHADP
8
REVISION F
0.80 .031
02
01
SEE NOTE 4
1.65 .065
0.20 .008
REF
C
C
"G"
2.00[0.079]
C
0.80 .031 REF
4.98 .196 REF
SH40-20-01-DV-N
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
* LSEM-1XX-XX.X-X-DV-A-S SHOWN
(SAME AS FIG1 DIFFERENT AS SHOWN)
(* =NOT TOOLED)
FIG 2 -S OPTION
DO NOT SCALE DRAWING
SHEET SCALE: 1:0.2
0.8mm PITCH TERMINAL/SOCKET COMBO
LSEM-1XX-XX.X-X-DV-A-X-XX-TR
04/01/2009
SHEET
2
OF
3
F:\DWG\MISC\MKTG\LSEM-1XX-XX.X-X-DV-A-X-XX-TR-MKT.SLDDRW
BY:
CHADP
REVISION F
C
5.50 .217
"H"
0.13 .005 REF
0.45 .018
"K"
REF
FIG 3 -K OPTION
*LSEM-120-03.0-X-DV-A-S-K SHOWN
(SAME AS FIG 2 DIFFERENT AS SHOWN)
(* =NOT TOOLED)
(* =NOT TOOLED)
"L" REF
"N"
WT-36-XX-T
(SEE TABLE 4)
"M"
(* = NOT TOOLED)
* LSEM-1XX-XX.X-X-DV-A-S-WT SHOWN
(SAME AS FIG 1 DIFFERENT AS SHOWN)
(* =NOT TOOLED)
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
FIG 4 *-WT OPTION
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 5:1
0.8mm PITCH TERMINAL/SOCKET COMBO
LSEM-1XX-XX.X-X-DV-A-X-XX-TR
04/01/2009
SHEET
3
OF
3
F:\DWG\MISC\MKTG\LSEM-1XX-XX.X-X-DV-A-X-XX-TR-MKT.SLDDRW
BY:
CHADP
Microcontroller MCU
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