DP3ED16MX8R8KY5-DP-XX50C datasheet, PDF

Datasheet> All Categories > storage> storage> DP3ED16MX8R8KY5-DP-XX50C

DP3ED16MX8R8KY5-DP-XX50C: DescriptionEDO DRAM Module, 16MX8, 50ns, CMOS, PDSO32, STACK, LEADLESS, MODULE, TSOP-32; Categorystorage storage; File Size201KB，2 Pages; ManufacturerB&B Electronics Manufacturing Company

Download Datasheet Parametric Compare View All

DP3ED16MX8R8KY5-DP-XX50C Overview

EDO DRAM Module, 16MX8, 50ns, CMOS, PDSO32, STACK, LEADLESS, MODULE, TSOP-32

DP3ED16MX8R8KY5-DP-XX50C Parametric

Parameter Name	Attribute value
Maker	B&B Electronics Manufacturing Company
Parts packaging code	TSOP
package instruction	ATSOP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PDSO-G32
memory density	134217728 bit
Memory IC Type	EDO DRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX8
Package body material	PLASTIC/EPOXY
encapsulated code	ATSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, PIGGYBACK, THIN PROFILE
Certification status	Not Qualified
Maximum seat height	2.4892 mm
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

Preview

Download Datasheet

View All

16Mx8 50 - 60ns, TSOP Stack

30A228-10

High Density Memory Device

ADVANCED INFORMATION

DESCRIPTION:

The

M-Densus

series is a family of interchangeable memory

modules. The 64 Megabit DRAM is a member of this family

which utilizes the new and innovative space saving TSOP

stacking technology. The module is constructed with two

8 Meg x 8 EDO, 3.3 Volt DRAM’s available in a 128 Megabit

compatible pin-out.

The 64 Megabit based

M-Densus

modules have been

designed to fit in the same footprint as the 16 Meg x 8 DRAM

TSOP monolithic. This allows the memory board designer to

upgrade the memory in their products without redesigning the

memory board, thus saving time and money.

FEATURES:

•

Configurations Available:

128 Megabit: 16 Meg x 8

•

Access Times: 50, 60ns (max.)

•

3.3 Volt Supply

•

Common Data Inputs and Outputs

•

Extended Data Out Capability (EDO)

•

4K/8K 64ms Refresh

•

3 Variations of Refresh:

- RAS only Refresh

- CAS before RAS Refresh

- Hidden Refresh

•

Package: Leadless TSOP Module

M-Densus

128 Megabit CMOS

3.3V EDO DRAM

DP3ED16MX8RKY5

PIN-OUT DIAGRAM

PIN NAMES

A0 - A11

A0 - A12*

DQ0 - DQ7

CAS

RAS0 - RAS1

N.C.

Row Address:

A0 - A11

Column Address: A0 - A10

Refresh Address: A0 - A11

Row Address:

A0 - A12

Column Address: A0 - A9

Refresh Address: A0 - A12

Data In / Data Out

Column Address Strobe

Row Address Enables

Data Write Enable

Data Output Enable

Power Supply (+3.3V)

Ground

No Connect

FUNCTIONAL BLOCK DIAGRAM

A12 for 8K refresh device.

30A228-10

REV. A

This document contains information on a product under consideration for

development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right

hange or discontinue information on this product without prior notice.

DP3ED16MX8R8KY5-DP-XX50C Related Products

	DP3ED16MX8R8KY5-DP-XX50C	DP3ED16MX8R8KY5-DP-XX60C	DP3ED16MX8RKY5-DP-XX60C	DP3ED16MX8RKY5-DP-XX50C
Description	EDO DRAM Module, 16MX8, 50ns, CMOS, PDSO32, STACK, LEADLESS, MODULE, TSOP-32	EDO DRAM Module, 16MX8, 60ns, CMOS, PDSO32, STACK, LEADLESS, MODULE, TSOP-32	EDO DRAM Module, 16MX8, 60ns, CMOS, PDSO32, STACK, LEADLESS, MODULE, TSOP-32	EDO DRAM Module, 16MX8, 50ns, CMOS, PDSO32, STACK, LEADLESS, MODULE, TSOP-32
Maker	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company	B&B Electronics Manufacturing Company
Parts packaging code	TSOP	TSOP	TSOP	TSOP
package instruction	ATSOP,	ATSOP,	ATSOP,	ATSOP,
Contacts	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	50 ns	60 ns	60 ns	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
memory density	134217728 bit	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	32	32	32	32
word count	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	16MX8	16MX8	16MX8	16MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	ATSOP	ATSOP	ATSOP	ATSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, PIGGYBACK, THIN PROFILE	SMALL OUTLINE, PIGGYBACK, THIN PROFILE	SMALL OUTLINE, PIGGYBACK, THIN PROFILE	SMALL OUTLINE, PIGGYBACK, THIN PROFILE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.4892 mm	2.4892 mm	2.4892 mm	2.4892 mm
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	-

Recommended Resources

A delayed pull-in relay circuit diagram

Lithium-ion battery charging control chip LM3420 circuit

SBX1483-11/12/51/52 (TVs, VCRs, audio equipment, air conditioners and toys) infrared remote control receiving circuit

MC145026 (general) infrared, ultrasonic or radio frequency remote control transmission encoding circuit-02

GF2A op amp audio amplifier circuit diagram

T6668 is used for bus stop announcer

How to install the driver through INF file in WinXp?: I have written a driver and hope to install it using an INF file. The INF and sys are in the same directory. 1) Do I just need to have these two files? 2) Do I just need to right-click on the inf and ...; tangwq Embedded System

1: 1...; liaoyl412823591 Embedded System

I would like to ask if there is a PDF of the fourth edition of "The Definitive Guide to Operational Amplifiers": I want to learn about power supply recently and want to find some suitable information...; WANGGX Analog electronics

Serial port connection debugging: I connect the development machine and the target machine directly via the serial port. I use Microsoft ActiveSync on the PC. Why can't I connect when I run repllog.exe on the target machine? What do I...; hongfei Embedded System

Ask a question: Under what compiler can the hello word program be compiled? Why do I always say that some functions are not declared when I compile it under the x86 simulator? Thank you: Ask a question: Under what compiler can the hello word program be compiled? Why do I always say that some functions are not declared when I compile it under the x86 simulator? Thank you...; edwinzhu Embedded System

I need help from you guys, I need a chip that can boost 5V to 36V, thank you: The input can provide 5V 5A power supply, and the output can reach 36V 0.5A. I need the chip and circuit....; kaka009 Analog electronics

Remote ECG Real-time Monitor Software System Based on GPRS

In today's society, heart disease has seriously affected people's life safety. Many patients with sudden heart attacks are threatened because they cannot get timely treatment. Traditional ECG monito...[Details]
Application of Sensing and RFID in Blood Management Analysis

1 Introduction The integration of sensor technology and RFID has just started. As one of the world's major manufacturing and consumer countries, China should seize this opportunit...[Details]
Simplified pulse oximeter integrated design using MCU

Pulse oximeters, non-invasive instruments used to monitor a patient's blood oxygen saturation, are benefiting from moving away from expensive discrete component solutions toward more integrated design...[Details]
Development of high performance, low saturation linear regulator

As the whole equipment is constantly miniaturized and power-saving, low-power-consumption low-dropout linear regulators (LDO) are becoming the mainstream of the linear regulator market for switching p...[Details]
Bipedal robot joints based on pneumatic artificial muscles

A biped robot joint constructed by pneumatic artificial muscles is introduced. The joint uses the flexible characteristics of pneumatic artificial muscles to effectively control the impact of the la...[Details]
Design Challenges of Digital Hearing Aids

Designers of hearing aids have stringent requirements. Hearing aids must be small enough to fit in or behind the ear, operate on ultra-low power, and be free of noise or distortion. To meet these requ...[Details]
Development of a miniature low-power and high-capacity ECG recorder

Conventional ECG recorders are one of the main means for doctors to diagnose heart diseases, but they can only record short heartbeats. In many cases, it is difficult to record ECG changes during a...[Details]
Wireless sleep apnea monitoring system

Preface Sleep apnea is a very common sleep breathing disease. According to research, about 24% of adult men and 9% of adult women, or more than 2 million people, suffer from this disease ...[Details]
Application of Bluetooth wireless communication in medical monitoring

Currently, it is impossible to dynamically obtain patient information in medical monitoring. Once the patient's condition worsens, emergency treatment cannot be implemented in the first place, and the...[Details]
Development of PCI Bus Data Output Board Driver (Figure)

PCI (Perip heral Component Interconnect) is an advanced high-performance 32/64-bit local bus that supports linear burst transmission and has a maximum data transmission rate of 132MB/s. At the same...[Details]
TD-SCDMA RF Test Summary (Part 3)

This issue will briefly introduce the test related to spectrum - occupied bandwidth. Definition: Occupied bandwidth refers to the bandwidth corresponding to 99% of the total transmitted power, cent...[Details]
Design of multimedia mobile phone based on AK3210M processor

As mobile phones have evolved from simple voice communication tools to multimedia devices that integrate communication, imaging, and gaming, application processors are replacing baseband chips as t...[Details]
Automotive safety systems are changing from passive to active with the help of sensors

In the future, a complete automobile safety system must fully combine gyroscopes, accelerometers, steering wheel and brake pedal position detectors, and tire speed detection systems to accurately ...[Details]
Low Power Solution for GPON Pulse Mode Receivers

Broadband services supporting triple play voice, video and data are evolving for first mile customers (small businesses and homes). A key factor in this FTTx evolution is GPON (Gigabit Passive Opti...[Details]
High efficiency, small size DC/DC regulator solution

Today, various applications such as consumption, computers, industry and instruments urgently need compact and effective power solutions, while also meeting the requirements of efficiency, fast tra...[Details]

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components