MA4SPS302 SurMount™ Series
™
Surface Mount Monolithic
PIN Diode Chip
Features
•
•
•
•
•
•
•
Surface Mount Diode
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Power Handling (Efficient Heatsinking)
Case Style
ODS-1247
1, 2
A
B
Description
M/A-COM’s MA4SPS302 is a silicon-glass PIN diode
fabricated with M/A-COM’s patented HMIC™ process. This
device features two silicon pedestals embedded in a low loss
glass. The diode is formed on the top of one pedestal and
connections to the backside of the device are facilitated by
making the pedestal side walls conductive. Selective backside
metalization is applied producing a surface mount device. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch protection.
These
protective coatings prevent damage to the junction and the
anode air-bridge during handling and assembly.
C
D
E
D
D
Applications
These devices can be used in series and shunt switches for
wireless circuits where smaller area and profile are required.
Low parasitic values of L and C make additional circuit tuning
unnecessary. 2
Ω
R
S
value @ 1 mA makes the devices suitable
for smaller current consumption applications.
1.
2.
Backside metal: 0.1 micron thk. gold.
Hatched areas indicate bond pads.
Absolute Maximum Ratings
1
@ T
A
= +25°C (unless otherwise specified)
Parameter
Reverse Voltage
Forward Current
Operating Temperature
Storage Temperature
Mounting Temperature
Absolute Maximum
-70 V
100 mA
-65°C to +150°C
-65°C to +150°C
+235°C for 10 seconds
DIM.
A
B
C
D
E
INCHES
MIN.
MAX.
0.0520
0.0583
0.0201
0.0264
0.0040
0.0080
0.0180
0.0200
0.0140
0.0160
MILLIMETERS
MIN.
MAX.
1.320
1.480
0.510
0.670
0.102
0.203
0.457
0.508
0.355
0.406
1. Exceeding these limits may cause permanent damage.
Specifications subject to change without notice.
n
North America:
Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
V 2.0
1
Surface Mount Monolithic PIN Diode Chip
Electrical Specifications @ +25°C
Symbol
C
T
C
T
R
S
R
S
V
F
V
R
I
R
T
L
-40 Volts, 1 MHz
1
-40 Volts, 1 GHz
1, 3
10 mA, 100 MHz
2,
10 mA, 1 GHz
2, 3
10 mA
10
µ
A
-70V
10 mA / 6 mA
Test Conditions
MA4SPS302 SurMount™ Series
™
Units
pF
pF
Ω
Ω
Min.
Typ.
0.400
0.300
1.0
1.3
0.84
Max.
0.450
V
V
µ
A
1.00
-70
-120
10
460
ns
1. Total capacitance is equivalent to the sum of junction capacitance C
j
and parasitic capacitance.
2. Series resistance R
S
is equivalent to the total diode series resistance including the junction resistance R
j
.
3. R
S
and C
P
is measured on an HP4291A with die mounted in an ODS-186 package with conductive silver epoxy.
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly
recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Functional Schematic
1
Ls
ESD
These devices very susceptible to ESD and are rated Class 0
(0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF
±
10%, R = 1.5kΩ
±
1%]. Even though tested die pass 100V
ESD, they must be handled in a static-free environment.
Rp
Cp
Bonding Techniques
Attachment to a circuit board is made simple through the use of
surface mount technology. Mounting pads are conveniently
located on the bottom surface of these diodes and are removed
from the active junction locations. These diodes are well suited
for solder attachment onto hard and soft substrates. The use of
80/20 Au/Sn and 60/40 Sn/Pb solder is recommended.
Conductive epoxy paste for attachment may also be used, this
can be silk-screened, or used with a conductive sheet apoxy.
When soldering these diodes to a hard substrate, hot gas die
bonding is preferred. We recommend utilizing a vacuum tip and
a force of 60 to 100 grams applied normal to the top surface of
the part. When soldering to soft substrates, it is recommended
to use a lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are aligned with the
circuit board’s mounting pads Reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100
grams of force perpendicular to the top surface of the die.
Since the HMIC™ glass is transparent, the edges of the
mounting pads closest to each other can be visually inspected
through the die after attach is completed.
Specifications subject to change without notice.
n
North America:
Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
Rvia
Rvia
-
1. Rs = 2 * Rvia + Rp
+
V 2.0
2
Surface Mount Monolithic PIN Diode Chip
Typical Performance Curves @ +25°C
Typical Total Resistance R
S
vs. Forward
Current and Frequency
3
MA4SPS302 SurMount™ Series
™
Typical Total Capacitance C
P
vs. Reverse
Voltage and Frequency
0.600
0.500
Rs (Ohm)
2
0.400
Cp (pF)
0.300
0.200
0V
-5V
0.100
0.000
-40V
1
500uA
0
0
100
200
300
400
500
600
700
800
900
1000
1mA
2mA
10mA
50mA
0
100
200
300
400
500
600
700
800
900
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
Cp vs. V @ 100 MHz and 1 GHz
0.600
0.550
0.500
1.E+06
Rp vs. V @ 100 MHz and 1 GHz
Rp ( Ohms )
100 MHz
Cp ( pF )
0.450
0.400
0.350
0.300
0.250
0.200
0.00
5.00
10.00
15.00
20.00
25.00
30.00
35.00
40.00
1 GHz
1.E+05
1 GHz
1.E+04
100 MHz
1.E+03
0.00
5.00
10.00
15.00
20.00
25.00
30.00
35.00
40.00
V
V
Rs vs I @ 100 MHz and 1 GHz
10.00
Ls vs. Frequency @ 10 mA
0.500
0.490
0.480
0.470
0.460
0.450
0.440
0.430
0.420
0.410
0.400
500.0
100 MHz
Rs ( Ohms )
1 GHz
1.00
0.10
0.01
Ls ( nH )
0.10
1.00
10.00
100.00
700.0
900.0
1100.0
1300.0
1500.0
1700.0
I ( mA )
FREQUENCY ( MHz )
Specifications subject to change without notice.
n
North America:
Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
V 2.0
3
Embedded System
京公网安备 11010802033920号
EEWORLD
