SNJ54ALS870FK datasheet, PDF - EEWORLD Datasheet

SNJ54ALS870FK: Description16X4 STANDARD SRAM, 24ns, CQCC28; Categorystorage storage; File Size94KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SNJ54ALS870FK Overview

16X4 STANDARD SRAM, 24ns, CQCC28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCN, LCC28,.45SQ
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Maximum access time	24 ns
JESD-30 code	S-CQCC-N28
length	11.43 mm
memory density	64 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	28
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm
Base Number Matches	1

	SNJ54ALS870FK	SNJ54ALS870JT
Description	16X4 STANDARD SRAM, 24ns, CQCC28	16X4 STANDARD SRAM, 24ns, CDIP24
Is it Rohs certified?	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments
package instruction	QCCN, LCC28,.45SQ	DIP, DIP24,.3
Reach Compliance Code	not_compliant	not_compliant
ECCN code	3A001.A.2.C	3A001.A.2.C
Maximum access time	24 ns	24 ns
JESD-30 code	S-CQCC-N28	R-GDIP-T24
memory density	64 bit	64 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	4	4
Number of functions	1	1
Number of terminals	28	24
word count	16 words	16 words
character code	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	16X4	16X4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP
Encapsulate equivalent code	LCC28,.45SQ	DIP24,.3
Package shape	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED

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