AM25LS381DMB datasheet, PDF - EEWORLD Datasheet

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AM25LS381DMB: DescriptionArithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP20, HERMETIC SEALED, CERDIP-20; Categorylogic logic; File Size328KB，12 Pages; ManufacturerAMD; Websitehttp://www.amd.com; Environmental Compliance

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AM25LS381DMB Overview

Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP20, HERMETIC SEALED, CERDIP-20

AM25LS381DMB Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP20,.3
Contacts	20
Reach Compliance Code	unknown
Other features	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD
series	TTL/H/L
JESD-30 code	R-CDIP-T20
JESD-609 code	e0
length	24.4602 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	ARITHMETIC LOGIC UNIT
Number of digits	4
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum supply current (ICC)	40 mA
propagation delay (tpd)	50 ns
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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	AM25LS381DMB	AM25LS381FMB	AM25LS2517XC	AM25LS2517PCB	AM25LS2517FMB	AM25LS2517DMB	AM25LS381PC	AM25LS381PCB
Description	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP20, HERMETIC SEALED, CERDIP-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDFP20, FP-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, 0.091 X 0.108 INCH, DIE-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDFP20, FP-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP20, HERMETIC SEALED, CERDIP-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20	Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20
Parts packaging code	DIP	DFP	DIE	DIP	DFP	DIP	DIP	DIP
package instruction	DIP, DIP20,.3	DFP, FL20,.3	DIE,	DIP, DIP20,.3	DFP, FL20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Contacts	20	20	20	20	20	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Other features	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD	CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD
series	TTL/H/L	TTL/H/L	TTL/H/L	TTL/H/L	TTL/H/L	TTL/H/L	TTL/H/L	TTL/H/L
JESD-30 code	R-CDIP-T20	R-CDFP-F20	R-XUUC-N20	R-PDIP-T20	R-CDFP-F20	R-CDIP-T20	R-PDIP-T20	R-PDIP-T20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT
Number of digits	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	70 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DFP	DIE	DIP	DFP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	UNCASED CHIP	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE
Maximum supply current (ICC)	40 mA	40 mA	47 mA	47 mA	43 mA	43 mA	43 mA	43 mA
propagation delay (tpd)	50 ns	50 ns	44 ns	44 ns	50 ns	50 ns	44 ns	44 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	FLAT	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL
Is it lead-free?	Lead free	Contains lead	-	Contains lead	Contains lead	Lead free	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	AMD	-	AMD	AMD	AMD	AMD	AMD	AMD
JESD-609 code	e0	e0	-	e0	e0	e0	e0	e0
length	24.4602 mm	12.827 mm	-	26.289 mm	12.827 mm	24.4602 mm	26.289 mm	26.289 mm
Encapsulate equivalent code	DIP20,.3	FL20,.3	-	DIP20,.3	FL20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	5.08 mm	2.159 mm	-	5.08 mm	2.159 mm	5.08 mm	5.08 mm	5.08 mm
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	2.54 mm	1.27 mm	-	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	6.731 mm	-	7.62 mm	6.731 mm	7.62 mm	7.62 mm	7.62 mm

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