Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP20,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Other features | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT |
| series | TTL/H/L |
| JESD-30 code | R-PDIP-T20 |
| JESD-609 code | e0 |
| length | 26.289 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 47 mA |
| propagation delay (tpd) | 44 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |

| AM25LS2517PCB | AM25LS381DMB | AM25LS381FMB | AM25LS2517XC | AM25LS2517FMB | AM25LS2517DMB | AM25LS381PC | AM25LS381PCB | |
|---|---|---|---|---|---|---|---|---|
| Description | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDFP20, FP-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, 0.091 X 0.108 INCH, DIE-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDFP20, FP-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20 |
| Parts packaging code | DIP | DIP | DFP | DIE | DFP | DIP | DIP | DIP |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DIE, | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| Other features | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD; CARRY OUTPUT | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD |
| series | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| JESD-30 code | R-PDIP-T20 | R-CDIP-T20 | R-CDFP-F20 | R-XUUC-N20 | R-CDFP-F20 | R-CDIP-T20 | R-PDIP-T20 | R-PDIP-T20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DFP | DIE | DFP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | UNCASED CHIP | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| Maximum supply current (ICC) | 47 mA | 40 mA | 40 mA | 47 mA | 43 mA | 43 mA | 43 mA | 43 mA |
| propagation delay (tpd) | 44 ns | 50 ns | 50 ns | 44 ns | 50 ns | 50 ns | 44 ns | 44 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL |
| Is it lead-free? | Contains lead | Lead free | Contains lead | - | Contains lead | Lead free | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | - | AMD | AMD | AMD | AMD | AMD |
| JESD-609 code | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| length | 26.289 mm | 24.4602 mm | 12.827 mm | - | 12.827 mm | 24.4602 mm | 26.289 mm | 26.289 mm |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | FL20,.3 | - | FL20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum seat height | 5.08 mm | 5.08 mm | 2.159 mm | - | 2.159 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 6.731 mm | - | 6.731 mm | 7.62 mm | 7.62 mm | 7.62 mm |