MT41K256M8DA-125IT:KTR datasheet, PDF

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MT41K256M8DA-125IT:KTR: DescriptionDDR DRAM, 256MX8, CMOS, PBGA78, 8 X 10.50 MM, LEAD FREE, FBGA-78; Categorystorage storage; File Size3MB，212 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT41K256M8DA-125IT:KTR Overview

DDR DRAM, 256MX8, CMOS, PBGA78, 8 X 10.50 MM, LEAD FREE, FBGA-78

MT41K256M8DA-125IT:KTR Parametric

Parameter Name	Attribute value
Maker	Micron Technology
package instruction	TFBGA,
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B78
length	10.5 mm
memory density	2147483648 bit
Memory IC Type	DDR DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	78
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
organize	256MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Maximum seat height	1.2 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.45 V
Minimum supply voltage (Vsup)	1.283 V
Nominal supply voltage (Vsup)	1.35 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm
Base Number Matches	1

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2Gb: x4, x8, x16 DDR3L SDRAM

Description

DDR3L SDRAM

MT41K512M4 – 64 Meg x 4 x 8 banks

MT41K256M8 – 32 Meg x 8 x 8 banks

MT41K128M16 – 16 Meg x 16 x 8 banks

Description

The 1.35V DDR3L SDRAM device is a low-voltage ver-

sion of the 1.5V DDR3 SDRAM device. Refer to the

DDR3 (1.5V) SDRAM data sheet specifications when

running in 1.5V compatible mode.

•

Automatic self refresh (ASR)

Write leveling

Multipurpose register

Output driver calibration

Options

• Configuration

– 512 Meg x 4

– 256 Meg x 8

– 128 Meg x 16

• FBGA package (Pb-free) – x4, x8

– 78-ball (8mm x 10.5mm)

Rev. M, K

– 78-ball FBGA (9mm x 11.5mm)

Rev. D

• FBGA package (Pb-free) – x16

– 96-ball FBGA (9mm x 14mm)

Rev. D

– 96-ball FBGA (8mm x 14mm)

Rev. K

• Timing – cycle time

– 1.071ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.875ns @ CL = 7 (DDR3-1066)

• Operating temperature

– Commercial (0°C

≤

+95°C)

– Industrial (–40°C

≤

+95°C)

• Revision

Marking

512M4

256M8

128M16

Features

•

= V

DDQ

= 1.35V (1.283–1.45V)

Backward-compatible to V

= V

DDQ

= 1.5V ±0.075V

Differential bidirectional data strobe

8n-bit prefetch architecture

Differential clock inputs (CK, CK#)

8 internal banks

Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

Programmable CAS (READ) latency (CL)

Programmable posted CAS additive latency (AL)

Programmable CAS (WRITE) latency (CWL)

Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

Selectable BC4 or BL8 on-the-fly (OTF)

Self refresh mode

of 0°C to +95°C

– 64ms, 8192-cycle refresh at 0°C to +85°C

– 32ms at +85°C to +95°C

Self refresh temperature (SRT)

-107

-125

-15E

-187E

None

:D/ :M / :K

•

Table 1: Key Timing Parameters

Speed Grade

-107

1, 2, 3

-125

1, 2

-15E

-187E

Notes:

Data Rate (MT/s)

1866

1600

1333

1066

Target

RCD-

RP-CL

13-13-13

11-11-11

9-9-9

7-7-7

RCD

(ns)

CL (ns)

13.91

13.75

13.5

13.1

13.91

13.75

13.5

13.1

13.91

13.75

13.5

13.1

1. Backward compatible to 1066, CL = 7 (-187E).

2. Backward compatible to 1333, CL = 9 (-15E).

3. Backward compatible to 1600, CL = 11 (-107).

PDF: 09005aef83ed2952

2Gb_DDR3L.pdf - Rev. K 9/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

2Gb: x4, x8, x16 DDR3L SDRAM

Description

Contents

State Diagram ................................................................................................................................................ 11

Functional Description ................................................................................................................................... 12

Industrial Temperature ............................................................................................................................... 12

General Notes ............................................................................................................................................ 12

Functional Block Diagrams ............................................................................................................................. 14

Ball Assignments and Descriptions ................................................................................................................. 16

Package Dimensions ....................................................................................................................................... 22

Electrical Specifications .................................................................................................................................. 26

Absolute Ratings ......................................................................................................................................... 26

Input/Output Capacitance .......................................................................................................................... 27

Thermal Characteristics .................................................................................................................................. 28

Electrical Specifications – I

Specifications and Conditions ............................................................................ 30

Electrical Characteristics – I

Specifications .................................................................................................. 41

Electrical Specifications – DC and AC .............................................................................................................. 44

DC Operating Conditions ........................................................................................................................... 44

Input Operating Conditions ........................................................................................................................ 45

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 49

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 52

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 54

ODT Characteristics ....................................................................................................................................... 55

1.35V ODT Resistors ................................................................................................................................... 56

ODT Sensitivity .......................................................................................................................................... 57

ODT Timing Definitions ............................................................................................................................. 57

Output Driver Impedance ............................................................................................................................... 61

34 Ohm Output Driver Impedance .............................................................................................................. 62

DDR3L 34 Ohm Driver ................................................................................................................................ 63

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 64

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 65

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 65

Output Characteristics and Operating Conditions ............................................................................................ 67

Reference Output Load ............................................................................................................................... 70

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 70

Slew Rate Definitions for Differential Output Signals .................................................................................... 72

Speed Bin Tables ............................................................................................................................................ 73

Electrical Characteristics and AC Operating Conditions ................................................................................... 77

Command and Address Setup, Hold, and Derating ........................................................................................... 97

Data Setup, Hold, and Derating ...................................................................................................................... 104

Commands – Truth Tables ............................................................................................................................. 112

Commands ................................................................................................................................................... 115

DESELECT ................................................................................................................................................ 115

NO OPERATION ........................................................................................................................................ 115

ZQ CALIBRATION LONG ........................................................................................................................... 115

ZQ CALIBRATION SHORT .......................................................................................................................... 115

ACTIVATE ................................................................................................................................................. 115

READ ........................................................................................................................................................ 115

WRITE ...................................................................................................................................................... 116

PRECHARGE ............................................................................................................................................. 117

REFRESH .................................................................................................................................................. 117

SELF REFRESH .......................................................................................................................................... 118

DLL Disable Mode ..................................................................................................................................... 119

PDF: 09005aef83ed2952

2Gb_DDR3L.pdf - Rev. K 9/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x4, x8, x16 DDR3L SDRAM

Description

Input Clock Frequency Change ...................................................................................................................... 123

Write Leveling ............................................................................................................................................... 125

Write Leveling Procedure ........................................................................................................................... 127

Write Leveling Mode Exit Procedure ........................................................................................................... 129

Initialization ................................................................................................................................................. 130

Voltage Initialization / Change ....................................................................................................................... 132

Voltage Switching ............................................................................................................................... 133

Mode Registers .............................................................................................................................................. 134

Mode Register 0 (MR0) ................................................................................................................................... 135

Burst Length ............................................................................................................................................. 135

Burst Type ................................................................................................................................................. 136

DLL RESET ................................................................................................................................................ 137

Write Recovery .......................................................................................................................................... 137

Precharge Power-Down (Precharge PD) ...................................................................................................... 138

CAS Latency (CL) ....................................................................................................................................... 138

Mode Register 1 (MR1) ................................................................................................................................... 139

DLL Enable/DLL Disable ........................................................................................................................... 139

Output Drive Strength ............................................................................................................................... 140

OUTPUT ENABLE/DISABLE ...................................................................................................................... 140

TDQS Enable ............................................................................................................................................. 140

On-Die Termination .................................................................................................................................. 141

WRITE LEVELING ..................................................................................................................................... 141

POSTED CAS ADDITIVE Latency ................................................................................................................ 141

Mode Register 2 (MR2) ................................................................................................................................... 142

CAS Write Latency (CWL) ........................................................................................................................... 143

AUTO SELF REFRESH (ASR) ....................................................................................................................... 143

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 144

SRT vs. ASR ............................................................................................................................................... 144

DYNAMIC ODT ......................................................................................................................................... 144

Mode Register 3 (MR3) ................................................................................................................................... 145

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 145

MPR Functional Description ...................................................................................................................... 146

MPR Register Address Definitions and Bursting Order ................................................................................. 147

MPR Read Predefined Pattern .................................................................................................................... 153

MODE REGISTER SET (MRS) Command ........................................................................................................ 153

ZQ CALIBRATION Operation ......................................................................................................................... 154

ACTIVATE Operation ..................................................................................................................................... 155

READ Operation ............................................................................................................................................ 157

WRITE Operation .......................................................................................................................................... 168

DQ Input Timing ....................................................................................................................................... 176

PRECHARGE Operation ................................................................................................................................. 178

SELF REFRESH Operation .............................................................................................................................. 178

Extended Temperature Usage ........................................................................................................................ 180

Power-Down Mode ........................................................................................................................................ 181

RESET Operation ........................................................................................................................................... 189

On-Die Termination (ODT) ............................................................................................................................ 191

Functional Representation of ODT ............................................................................................................. 191

Nominal ODT ............................................................................................................................................ 191

Dynamic ODT ............................................................................................................................................... 193

Dynamic ODT Special Use Case ................................................................................................................. 193

Functional Description .............................................................................................................................. 193

Synchronous ODT Mode ................................................................................................................................ 199

PDF: 09005aef83ed2952

2Gb_DDR3L.pdf - Rev. K 9/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT41K256M8DA-125IT:KTR Related Products

	MT41K256M8DA-125IT:KTR	MT41K128M16JT-125XIT:K	MT41K128M16JT-125XIT:KT
Description	DDR DRAM, 256MX8, CMOS, PBGA78, 8 X 10.50 MM, LEAD FREE, FBGA-78	DDR DRAM, 128MX16, CMOS, PBGA96, 8 X 14 MM, LEAD FREE, FBGA-96	DDR DRAM,
Reach Compliance Code	compliant	not_compliant	compliant
ECCN code	EAR99	EAR99	EAR99
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM
Maker	Micron Technology	Micron Technology	-
package instruction	TFBGA,	8 X 14 MM, LEAD FREE, FBGA-96	-
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	-
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-
JESD-30 code	R-PBGA-B78	R-PBGA-B96	-
length	10.5 mm	14 mm	-
memory density	2147483648 bit	2147483648 bit	-
memory width	8	16	-
Number of functions	1	1	-
Number of ports	1	1	-
Number of terminals	78	96	-
word count	268435456 words	134217728 words	-
character code	256000000	128000000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-
organize	256MX8	128MX16	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TFBGA	TFBGA	-
Package shape	RECTANGULAR	RECTANGULAR	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-
Maximum seat height	1.2 mm	1.2 mm	-
self refresh	YES	YES	-
Maximum supply voltage (Vsup)	1.45 V	1.45 V	-
Minimum supply voltage (Vsup)	1.283 V	1.283 V	-
Nominal supply voltage (Vsup)	1.35 V	1.35 V	-
surface mount	YES	YES	-
technology	CMOS	CMOS	-
Terminal form	BALL	BALL	-
Terminal pitch	0.8 mm	0.8 mm	-
Terminal location	BOTTOM	BOTTOM	-
width	8 mm	8 mm	-

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